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SAF7167AHW/V1,157

NXP Semiconductors

SAF7167AHW/V1,157 by NXP Semiconductors

D/A CONVERTER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 48; Package Code: HTFQFP; Package Shape: SQUARE;

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,159 parts In-Stock

1+ parts

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1k+ parts

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3,159

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Anansix

USA . 2,372 parts In-Stock

1+ parts

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1k+ parts

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2,372

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Digiode

USA . 2,323 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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2,323

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 428 parts In-Stock

1+ parts

$20.460

100+ parts

-

1k+ parts

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10k+ parts

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428

$20.460

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Microchip USA

USA . 411 parts In-Stock

1+ parts

$25.540

100+ parts

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1k+ parts

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411

$25.540

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One Stop Electronics

USA . 420 parts In-Stock

1+ parts

$32.000

100+ parts

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1k+ parts

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420

$32.000

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UNI Independent Distributors

Spain . 5,962 parts In-Stock

1+ parts

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5,962

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Corphita

USA . 843 parts In-Stock

1+ parts

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843

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Technical Specifications

Digital-to-Analog Converters SAF7167AHW/V1,157 attributes and parameters. Explore more Digital-to-Analog Converters devices from NXP Semiconductors

Converter Specifications

Technology:

CMOS

Input Format:

Parallel, 8 Bits

Input Bit Code:

Binary, 2's Complement Binary

Maximum Linearity Error (EL):

0.3906 %

Nominal Settling Time (tstl):

16.5 ns

No. of Bits:

8

No. of Functions:

1

Electrical Specifications

Nominal Supply Voltage:

5 V

Minimum Analog Output Voltage:

1.25 V

Maximum Analog Output Voltage:

1.5 V

Operating Conditions

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Form Factor

No. of Terminals:

48

Terminal Form:

Terminal Position:

Quad

Terminal Pitch:

0.02 in (0.5 mm)

Surface Mount:

Yes

Width:

0.276 in (7 mm)

Length:

0.276 in (7 mm)

Maximum Seated Height:

0.047 in (1.2 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Shape:

Package Style:

Flatpack, Heat Sink/Slug, Thin Profile, Fine Pitch

Package Code:

Standards and Codes

JESD-30 Code:

S-PQFP-G48

Trade Compliance

SAF7167AHW/V1,157 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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