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S912XDG256F1MAA

NXP Semiconductors

S912XDG256F1MAA by NXP Semiconductors

Precision designed semiconductors & electronic elements tailored for critical industrial & commercial solutions.

Median Price

$27.625

Lifecycle Status

-

Suppliers In-Stock

8

In-Stock Inventory

1k+

S912XDG256F1MAA by NXP Semiconductors
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Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 39 parts In-Stock

1+ parts

-

100+ parts

$21.000

1k+ parts

$18.790

10k+ parts

$17.680

39

-

$21.000

$18.790

$17.680

DigiKey

USA . 39 parts In-Stock

1+ parts

-

100+ parts

$27.630

1k+ parts

-

10k+ parts

-

39

-

$27.630

-

-

Verical

USA . 39 parts In-Stock

1+ parts

-

100+ parts

$27.625

1k+ parts

-

10k+ parts

-

39

-

$27.625

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,062 parts In-Stock

1+ parts

$16.768

100+ parts

-

1k+ parts

-

10k+ parts

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1,062

$16.768

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-

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Vyrian

USA . 3,176 parts In-Stock

1+ parts

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3,176

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Anansix

USA . 2,548 parts In-Stock

1+ parts

-

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2,548

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-

-

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TME

Poland . 458 parts In-Stock

1+ parts

-

100+ parts

$24.710

1k+ parts

-

10k+ parts

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458

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$24.710

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Flip Electronics

USA . 350 parts In-Stock

1+ parts

-

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350

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 3,176 parts In-Stock

1+ parts

$13.500

100+ parts

$12.970

1k+ parts

$12.710

10k+ parts

$12.450

3,176

$13.500

$12.970

$12.710

$12.450

Vigor

Singapore . 1,260 parts In-Stock

1+ parts

$14.180

100+ parts

-

1k+ parts

-

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1,260

$14.180

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-

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Corphita

USA . 199 parts In-Stock

1+ parts

$15.885

100+ parts

-

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199

$15.885

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Microchip USA

USA . 1,239 parts In-Stock

1+ parts

$47.936

100+ parts

-

1k+ parts

-

10k+ parts

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1,239

$47.936

-

-

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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3,000

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Technical Specifications

Additional Parts S912XDG256F1MAA attributes and parameters. Explore more Additional Parts devices from NXP Semiconductors

Technical Specifications

Core Processor:

HCS12X

Other Names:

935309983557

Speed:

80MHz

Operating Temperature:

-40°C ~ 125°C (TA)

Category:

Integrated Circuits (ICs)
Embedded Microcontrollers

Program Memory Type:

FLASH

RAM Size:

14K x 8

Number of I/O:

59

Peripherals:

LVD, POR, PWM, WDT

Mounting Type:

Surface Mount

Oscillator Type:

External

Supplier Device Package:

80-QFP (14x14)

Standard Package:

420

EEPROM Size:

4K x 8

Series:

HCS12X

Package / Case:

80-QFP

Core Size:

16-Bit

Connectivity:

CANbus, I2C, SCI, SPI

Program Memory Size:

256KB (256K x 8)

Package:

Tray

Data Converters:

A/D 8x10b, 16x10b

Voltage - Supply (Vcc/Vdd):

2.35V ~ 5.5V

Base Product Number:

S912

Moisture Sensitivity Level (MSL):

3 (168 Hours)

Trade Compliance

S912XDG256F1MAA Miscellaneous Components trade compliance attributes, and parameters.

ECCN

3A991A2

HTS

8542.31.0001

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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