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PSSI2021SAY

NXP Semiconductors

PSSI2021SAY by NXP Semiconductors

PSSI2021SAY by NXP Semiconductors is a small outline, thin profile, shrink pitch IC with 5 terminals. It operates at a nominal voltage of 12V and has a max operating temperature of 150°C. This military-grade analog circuit is suitable for various applications requiring bipolar technology.

Median Price

$0.180

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

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Chip Stock

USA . 102,500 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 3,000 parts In-Stock

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Micros

Poland . 3,000 parts In-Stock

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$0.183

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Partservice

France . 3,000 parts In-Stock

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Micros sp.j. W. Kędra i J. Lic

Poland . 3,000 parts In-Stock

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Vyrian

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Nova Conductors

Japan . 900 parts In-Stock

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Anansix

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750

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Digiode

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Aztec Data Supply Inc.

USA . 4,242 parts In-Stock

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$2.290

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Semicontronic

India . 799 parts In-Stock

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$3.500

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$3.412

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$3.395

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One Stop Electronics

USA . 1,513 parts In-Stock

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$6.500

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Ampacity Inc.

Singapore . 1,279 parts In-Stock

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Corohmni

South Africa . 79 parts In-Stock

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AZTECH Wire

Italy . 7,866 parts In-Stock

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$15.721

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Lixinc

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Perfect Parts

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Kepictronics

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Authorized Procurement Solutions

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Cyclops Electronics Ltd (Excess)

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Futuretech Components

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Continental Prestige Electronics

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Supply Digital

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Corphita

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Glotronic Ltd.

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Argo Parts USA

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Overview

Discover the power of PSSI2021SAY by NXP Semiconductors, a top-quality product designed to revolutionize your applications. With its advanced manufacturing by NXP Semiconductors, this small outline, thin profile semiconductor offers incredible benefits and advantages. From its plastic/epoxy package body material to its surface mount capability, every detail has been meticulously crafted for optimal performance. Whether you need precise analog circuitry or reliable power supplies, the PSSI2021SAY is the perfect solution. Enjoy the value and advantages it brings to your projects, all while experiencing the exceptional quality that NXP Semiconductors is known for.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This product is made with a durable plastic/epoxy material, ensuring its longevity and resistance to damage.

Surface Mount: YES

With the surface mount capability, this product can be easily installed and connected to other electronic components, allowing for efficient assembly processes.

No. of Functions: 1

This product offers a single function, making it straightforward and specialized for the intended use, eliminating any unnecessary complexity.

Package Shape: RECTANGULAR

The rectangular package shape of this product simplifies its integration into various electronic systems, accommodating space limitations efficiently.

Nominal Supply Voltage (Vsup): 12 V

Operating at a 12 V nominal supply voltage, this product provides stable and reliable power, ensuring consistent performance.

Power Supplies (V): 12

Offering power supplies at 12 V, this product is compatible with many standard power sources, making it versatile and easily integrated into existing setups.

No. of Terminals: 5

With 5 terminals, this product provides sufficient connectivity options, allowing for multiple connections or configurations to suit specific application requirements.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline, thin profile, and shrink pitch package style of this product allows for compact and space-saving designs, ideal for applications with limited available space.

Maximum Operating Temperature: 150 °C

Able to withstand temperatures as high as 150°C, this product is suitable for demanding environments, ensuring its performance remains stable under harsh conditions.

Minimum Operating Temperature: -55 °C

With a minimum operating temperature of -55°C, this product is designed to endure extreme cold temperatures, making it reliable in various environments.

Terminal Finish: Tin (Sn)

Featuring a terminal finish of tin (Sn), this product offers excellent solderability and corrosion resistance, ensuring secure and reliable connections during assembly and throughout its lifespan.

Terminal Position: DUAL

The dual terminal position of this product provides flexibility in terms of connection orientations, facilitating ease of installation and compatibility with different system configurations.

Maximum Seated Height: 1.1 mm

With a maximum seated height of 1.1 mm, this product has a low profile, allowing for a compact overall design, especially useful in applications with height limitations.

Width (mm): 1.25 mm

Measuring only 1.25 mm in width, this product is slim and space-saving, enabling it to fit into tight spaces or densely populated circuit boards, maximizing efficiency.

Other IC type: ANALOG CIRCUIT

Being an analog circuit, this product is designed for precision signal processing, making it suitable for applications that require accurate and high-quality analog performance.

Maximum Time At Peak Reflow Temperature (s): 30

With a maximum time of 30 seconds at peak reflow temperature, this product ensures efficient and reliable soldering during assembly processes.

Peak Reflow Temperature °C: 260

Able to withstand peak reflow temperatures of up to 260°C, this product is compatible with common soldering techniques, providing ease of assembly in various manufacturing environments.

Length: 2 mm

Measuring just 2 mm in length, this product is compact and space-saving, allowing for efficient use of available space in electronic systems or devices.

Temperature Grade: MILITARY

Designed with a military-grade temperature range, this product is highly resilient to extreme temperature conditions, ensuring reliable performance even in demanding operational environments.

Maximum Supply Current (Isup): 2.2 mA

With a maximum supply current of 2.2 mA, this product operates with low power consumption, making it energy-efficient and potentially cost-effective for extended use.

Technology: BIPOLAR

Built with bipolar technology, this product provides precise and stable signal amplification and processing, making it well-suited for applications requiring superior analog performance.

Terminal Form: GULL WING

Featuring a gull wing terminal form, this product offers secure and reliable connections, ensuring efficient transmission of signals and power between the product and other components.

Terminal Pitch: 0.65 mm

With a terminal pitch of 0.65 mm, this product provides sufficient spacing between terminals, enabling easy and accurate soldering during assembly processes.

Moisture Sensitivity Level (MSL): 1

This product is designed with a moisture sensitivity level of 1, ensuring that it is not sensitive to moisture or prone to moisture-related damages during storage or operation.

Technical Specifications

Other Function Semiconductors PSSI2021SAY attributes and parameters. Explore more Other Function Semiconductors devices from NXP Semiconductors

Specs

Other IC type:

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e3

Length:

2 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

5

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

12

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

2.2 mA

Nominal Supply Voltage (Vsup):

12 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

Tin (Sn)

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

1.25 mm

Trade Compliance

PSSI2021SAY Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8541.21.00.75

SB

8541.21.00.80

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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