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PCU9661B

NXP Semiconductors

PCU9661B by NXP Semiconductors

PCU9661B by NXP Semiconductors is a low-profile bus controller with an 8-bit address bus and operates at a max supply voltage of 3.6V. It supports I2C communication, making it ideal for industrial applications. With a temp range of -40 °C to 85 °C, it's reliable in harsh environments.

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Digiode

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Vyrian

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ACDS - Activité Composants Distribution Service

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One Stop Electronics

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Corohmni

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Perfect Parts

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Corphita

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UNI Independent Distributors

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Kepictronics

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Cyclops Electronics Ltd (Excess)

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Glotronic Ltd.

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Overview

Elevate your designs with the PCU9661B from NXP Semiconductors, a leading innovator in semiconductor technology. This robust bus controller offers unmatched quality and reliability, ensuring optimal performance across diverse applications such as industrial automation, smart sensors, and communication systems. Benefit from its low power consumption and wide operating temperature range, making it perfect for demanding environments. Trust in NXP’s legacy of excellence to enhance your projects with superior connectivity and efficiency.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy enhances durability and resistance to environmental factors, making the product reliable for various applications.

Surface Mount: YES

Surface mount design allows for efficient use of space on circuit boards, enabling high-density configurations and easier automated assembly.

Maximum Supply Voltage: 3.6 V

A maximum supply voltage of 3.6 V supports standard low voltage digital logic, ensuring compatibility with many systems.

Address Bus Width: 8

An 8-bit address bus width facilitates communication with a wide range of devices while maintaining simplicity in hardware design.

Package Shape: SQUARE

The square package shape allows for balanced placement on printed circuit boards, enhancing thermal performance and layout efficiency.

No. of Terminals: 48

With 48 terminals, the product provides ample connectivity options for various peripherals and devices, improving its versatility.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The flatpack, low-profile design enables stacking and compact designs, critical for applications where space is limited.

Minimum Supply Voltage: 3 V

A minimum supply voltage of 3 V ensures compatibility with a wide range of battery-driven and low-power applications.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product is suitable for industrial applications where heat dissipation is crucial.

Minimum Operating Temperature: -40 °C

A minimum operating temperature of -40 °C allows the product to function in extreme environments, ideal for outdoor and harsh conditions.

Terminal Finish: PURE TIN

Pure tin plating offers excellent solderability and resistance to corrosion, enhancing the longevity and reliability of connections.

Terminal Position: QUAD

Quad terminal positioning improves access and soldering options, facilitating easier assembly and maintenance.

Maximum Seated Height: 1.6 mm

A low seated height contributes to a smaller overall profile, allowing for integration into compact designs and minimizing obstruction.

Width: 7 mm

A narrow width of 7 mm contributes to a compact footprint, making it suitable for space-constrained applications.

External Data Bus Width: 8

An 8-bit external data bus width allows for efficient data transfer and connection with various peripherals while keeping the design simple.

Maximum Clock Frequency: 12 MHz

A maximum clock frequency of 12 MHz ensures fast operation, improving the performance of data transfer in time-sensitive applications.

Length: 7 mm

Like its width, a length of 7 mm contributes to a compact design, supporting high-density circuit designs.

Temperature Grade: INDUSTRIAL

The industrial temperature grade signifies the product's reliability in demanding environments, meeting stringent standards for durability.

Peripheral IC Type: BUS CONTROLLER, I2C

Designed as a bus controller, this IC can manage multiple devices efficiently, essential for complex embedded systems.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and robust.

Terminal Form: GULL WING

Gull wing terminals provide better mechanical strength and are easier to solder, enhancing overall reliability and ease of assembly.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage of 3.3 V is ideal for modern electronic devices, ensuring compatibility with most microcontrollers and processors.

Terminal Pitch: 0.5 mm

A terminal pitch of 0.5 mm allows for dense layouts, suitable for advanced designs where space optimization is critical.

Drive Interface Standard: IEEE 1149.1

Compliance with the IEEE 1149.1 standard ensures compatibility with testing and debugging tools, simplifying product development and maintenance.

Technical Specifications

Bus Controllers PCU9661B attributes and parameters. Explore more Bus Controllers devices from NXP Semiconductors

Specs

Address Bus Width:

8

Maximum Clock Frequency:

12 MHz

Drive Interface Standard:

IEEE 1149.1

External Data Bus Width:

8

JESD-30 Code:

S-PQFP-G48

Length:

7 mm

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Maximum Seated Height:

1.6 mm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

PURE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

7 mm

Peripheral IC Type:

Trade Compliance

PCU9661B Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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