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PCF8591P,112

NXP Semiconductors

PCF8591P,112 by NXP Semiconductors

PCF8591P,112 by NXP Semiconductors is an 8-bit ADC with 4 analog in channels. It operates at a max temp of 85°C and min temp of -40°C. Ideal for data acquisition applications due to its 2'S COMPLEMENT BINARY output format and 0.0111 MHz sample rate.

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5

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Vyrian

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Infinite Electronics LLP

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Nova Conductors

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One Stop Electronics

USA . 1,300 parts In-Stock

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AZTECH Wire

Italy . 358 parts In-Stock

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Corohmni

South Africa . 453 parts In-Stock

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Aztec Data Supply Inc.

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Microchip USA

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Semicontronic

India . 1,350 parts In-Stock

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Ampacity Inc.

Singapore . 480 parts In-Stock

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Continental Prestige Electronics

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Argo Parts USA

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Overview

Unlock endless possibilities with the NXP Semiconductors PCF8591P,112 Analog-to-Digital Converter! This innovative device offers unparalleled quality and precision, making it a top choice for a wide range of applications. With 4 analog input channels and 8 bits of resolution, this converter delivers fast and accurate results every time. Whether you're designing a new project or upgrading an existing one, the PCF8591P,112 provides exceptional value, benefits, and advantages that will exceed your expectations. Trust NXP Semiconductors to deliver cutting-edge technology that empowers you to create without limits.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body makes the product durable and lightweight, ideal for applications where weight and durability are important factors.

No. of Analog In Channels: 4

Having 4 analog input channels allows for multiple signals to be converted simultaneously, improving efficiency and reducing the need for additional converters.

No. of Bits: 8

With 8 bits of resolution, the converter provides a good balance between accuracy and speed, making it suitable for a wide range of applications.

Maximum Linearity Error (EL): 0.5859%

The low maximum linearity error ensures accurate conversion of analog signals to digital, making the product reliable for precise measurements.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, the converter can withstand high temperature environments, increasing its versatility in different applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the converter efficient and reliable for various electronic systems.

Output Format: SERIAL

The serial output format makes it easy to interface the converter with other digital systems, simplifying data transfer and integration into larger systems.

Technical Specifications

Analog-to-Digital Converters PCF8591P,112 attributes and parameters. Explore more Analog-to-Digital Converters devices from NXP Semiconductors

Converter Specifications

Converter Type:

No. of Analog In Channels:

4

No. of Functions:

1

No. of Bits:

8

Output Bit Code:

2's Complement Binary

Output Format:

Serial

Maximum Linearity Error (EL):

0.5859 %

Sample Rate:

11.1 kHz

Hold Mode:

Sample

Maximum Conversion Time:

90 µs

Electrical Specifications

Minimum Analog Input Voltage:

0 mV

Maximum Analog Input Voltage:

6 V

Nominal Supply Voltage:

5 V

Maximum Supply Current:

1 mA

Operating Conditions

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Form Factor

Terminal Position:

Dual

No. of Terminals:

16

Terminal Form:

Terminal Pitch:

0.1 in (2.54 mm)

Surface Mount:

No

Width:

0.3 in (7.62 mm)

Length:

0.749 in (19.025 mm)

Maximum Seated Height:

0.165 in (4.2 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

In-Line

Package Shape:

Package Equivalence Code:

DIP16,.3

Package Code:

DIP

Standards and Codes

JESD-30 Code:

R-PDIP-T16

Trade Compliance

PCF8591P,112 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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