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PCF1175CT/F2,112

NXP Semiconductors

PCF1175CT/F2,112 by NXP Semiconductors

LCD CLOCK; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 28; Package Code: SOP; Package Shape: RECTANGULAR;

Median Price

$2.065

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 1,060 parts In-Stock

1+ parts

$2.700

100+ parts

$1.829

1k+ parts

$1.506

10k+ parts

$1.462

1,060

$2.700

$1.829

$1.506

$1.462

Rochester

USA . 1,078 parts In-Stock

1+ parts

-

100+ parts

$1.430

1k+ parts

$1.280

10k+ parts

$1.200

1,078

-

$1.430

$1.280

$1.200

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,057 parts In-Stock

1+ parts

$1.510

100+ parts

-

1k+ parts

-

10k+ parts

-

3,057

$1.510

-

-

-

Vyrian

USA . 4,818 parts In-Stock

1+ parts

$1.590

100+ parts

-

1k+ parts

-

10k+ parts

-

4,818

$1.590

-

-

-

Flip Electronics

USA . 3,240 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,240

-

-

-

-

Anansix

USA . 2,313 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,313

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,186 parts In-Stock

1+ parts

$1.431

100+ parts

-

1k+ parts

-

10k+ parts

-

4,186

$1.431

-

-

-

Vigor

Singapore . 1,066 parts In-Stock

1+ parts

$2.210

100+ parts

-

1k+ parts

-

10k+ parts

-

1,066

$2.210

-

-

-

Microchip USA

USA . 474 parts In-Stock

1+ parts

$17.745

100+ parts

-

1k+ parts

-

10k+ parts

-

474

$17.745

-

-

-

Kepictronics

USA . 35,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

35,000

-

-

-

-

UNI Independent Distributors

Spain . 301 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

301

-

-

-

-

Technical Specifications

Clock ICs PCF1175CT/F2,112 attributes and parameters. Explore more Clock ICs devices from NXP Semiconductors

Specs

Additional Features:

COLON FLASH

Alarm:

NO

Application:

CAR CLOCK

Battery EOL Indicator:

NO

General IC Type:

Display Mode:

DIGITAL

Frequency Trimming:

YES

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e4

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Nominal Oscillator Frequency:

4.194304 MHZ

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Position:

DUAL

Trade Compliance

PCF1175CT/F2,112 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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