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PCA9703PW

NXP Semiconductors

PCA9703PW by NXP Semiconductors

PARALLEL IN SERIAL OUT; JESD-609 Code: e4; Terminal Finish: NICKEL PALLADIUM GOLD; Moisture Sensitivity Level (MSL): 1;

Median Price

$4.638

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Freelance Electronics

USA . 238 parts In-Stock

1+ parts

$4.638

100+ parts

$4.870

1k+ parts

$4.592

10k+ parts

-

238

$4.638

$4.870

$4.592

-

Flip Electronics

USA . 2,470 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,470

-

-

-

-

Vyrian

USA . 2,247 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,247

-

-

-

-

Digiode

USA . 892 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

892

-

-

-

-

Anansix

USA . 620 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

620

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,047 parts In-Stock

1+ parts

$12.000

100+ parts

-

1k+ parts

-

10k+ parts

-

1,047

$12.000

-

-

-

A-Z Elektronik GmbH

Germany . 10,034 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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10,034

-

-

-

-

Corphita

USA . 3,954 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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3,954

-

-

-

-

UNI Independent Distributors

Spain . 1,070 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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1,070

-

-

-

-

Technical Specifications

Digital Shift Registers PCA9703PW attributes and parameters. Explore more Digital Shift Registers devices from NXP Semiconductors

Specs

JESD-609 Code:

e4

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

Terminal Finish:

NICKEL PALLADIUM GOLD

Trade Compliance

PCA9703PW Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

Authentic purchasing experiences

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