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PCA2002CX8/5/1,025

NXP Semiconductors

PCA2002CX8/5/1,025 by NXP Semiconductors

PCA2002CX8/5/1,025 from NXP Semiconductors is a CMOS clock IC designed for commercial use. It operates within a voltage range of 1.55V and withstands temperatures from -10 °C to 60 °C. Ideal for various electronic applications, it features a durable plastic/epoxy package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,118 parts In-Stock

1+ parts

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4,118

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Vyrian

USA . 2,166 parts In-Stock

1+ parts

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2,166

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Anansix

USA . 1,318 parts In-Stock

1+ parts

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1,318

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 107 parts In-Stock

1+ parts

$0.598

100+ parts

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1k+ parts

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107

$0.598

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One Stop Electronics

USA . 1,024 parts In-Stock

1+ parts

$16.800

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1,024

$16.800

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UNI Independent Distributors

Spain . 4,802 parts In-Stock

1+ parts

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4,802

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Corphita

USA . 182 parts In-Stock

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182

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Overview

Elevate your designs with the PCA2002CX8/5/1,025 from NXP Semiconductors, a leader in high-quality electronic components. This robust clock IC offers exceptional reliability and performance across various applications, ensuring seamless operation even in challenging environments. With its advanced CMOS technology, it optimizes power efficiency while delivering precise timing solutions, enhancing your product's overall value and customer satisfaction.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package offers a lightweight and durable solution, enhancing the reliability and longevity of the clock IC under various conditions.

Power Supplies (V): 1.55V

Operating at a low supply voltage of 1.55V ensures energy efficiency, making this clock IC suitable for battery-powered applications where power conservation is critical.

Maximum Operating Temperature: 60 °C

With a maximum operating temperature of 60 °C, this clock IC is suitable for a range of environments, ensuring stable performance even in moderately elevated temperatures.

Minimum Operating Temperature: -10 °C

The capability to function down to -10 °C allows this clock IC to be used in colder climates and applications, ensuring versatility and reliability across diverse conditions.

Temperature Grade: COMMERCIAL

Being rated for commercial temperature ranges, this clock IC is designed for standard consumer applications which do not require extreme durability, thus reducing costs.

Technology: CMOS

Utilizing CMOS technology enables low power consumption alongside high-speed performance, making this clock IC an excellent choice for modern electronics requiring efficiency and quick processing.

Technical Specifications

Clock ICs PCA2002CX8/5/1,025 attributes and parameters. Explore more Clock ICs devices from NXP Semiconductors

Specs

Maximum Operating Temperature:

60 Cel

Minimum Operating Temperature:

-10 Cel

Package Body Material:

PLASTIC/EPOXY

Package Equivalence Code:

DIE OR CHIP

Power Supplies (V):

1.55

Qualification:

Not Qualified

Sub-Category:

Clock ICs

Technology:

CMOS

Temperature Grade:

Trade Compliance

PCA2002CX8/5/1,025 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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