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P89LPC925FN,129

NXP Semiconductors

P89LPC925FN,129 by NXP Semiconductors

Limited Part Number Data;

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

P89LPC925FN,129 by NXP Semiconductors
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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,927 parts In-Stock

1+ parts

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1k+ parts

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2,927

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Anansix

USA . 2,749 parts In-Stock

1+ parts

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2,749

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Digiode

USA . 2,331 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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2,331

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 212 parts In-Stock

1+ parts

$1.000

100+ parts

-

1k+ parts

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212

$1.000

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AZTECH Wire

Italy . 488 parts In-Stock

1+ parts

$13.470

100+ parts

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1k+ parts

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488

$13.470

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One Stop Electronics

USA . 936 parts In-Stock

1+ parts

$92.100

100+ parts

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1k+ parts

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936

$92.100

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Corphita

USA . 3,010 parts In-Stock

1+ parts

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3,010

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UNI Independent Distributors

Spain . 1,330 parts In-Stock

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1,330

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Technical Specifications

Additional Parts P89LPC925FN,129 attributes and parameters. Explore more Additional Parts devices from NXP Semiconductors

Technical Specifications

Core Processor:

8051

Other Names:

935274626129
P89LPC925FN-S
568-2249-5

Speed:

18MHz

Operating Temperature:

-40°C ~ 85°C (TA)

Category:

Integrated Circuits (ICs)
Embedded Microcontrollers

Program Memory Type:

FLASH

RAM Size:

256 x 8

Number of I/O:

18

Peripherals:

Brown-out Detect/Reset, LED, POR, PWM, WDT

Mounting Type:

Through Hole

Oscillator Type:

Internal

Supplier Device Package:

20-DIP

Standard Package:

18

Series:

LPC900

Package / Case:

20-DIP (0.300", 7.62mm)

Core Size:

8-Bit

Packaging:

Tube

Connectivity:

I2C, UART/USART

Program Memory Size:

8KB (8K x 8)

Data Converters:

A/D 4x8b; D/A 1x8b

Voltage - Supply (Vcc/Vdd):

2.4V ~ 3.6V

Base Product Number:

P89LPC925

Moisture Sensitivity Level (MSL):

1 (Unlimited)

Trade Compliance

P89LPC925FN,129 Miscellaneous Components trade compliance attributes, and parameters.

ECCN

EAR99

HTS

8542.31.0001

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Authentic purchasing experiences

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