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NX1117CEADJZ,115

NXP Semiconductors

NX1117CEADJZ,115 by NXP Semiconductors

NX1117CEADJZ,115 by NXP Semiconductors is a BIPOLAR regulator with adjustable output voltage from 1.25V to 18.8V and max current of 0.8A. Ideal for applications requiring precise voltage regulation in compact electronic devices due to its small form factor and surface-mount capability.

Median Price

$0.304

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1,857 parts In-Stock

1+ parts

-

100+ parts

$0.298

1k+ parts

$0.247

10k+ parts

$0.220

1,857

-

$0.298

$0.247

$0.220

Verical

USA . 1,357 parts In-Stock

1+ parts

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$0.309

1,357

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-

$0.309

Distributors (In-Stock)

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Nova Conductors

Japan . 26 parts In-Stock

1+ parts

$0.116

100+ parts

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26

$0.116

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Digiode

USA . 3,869 parts In-Stock

1+ parts

$0.124

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3,869

$0.124

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Vyrian

USA . 7,686 parts In-Stock

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7,686

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Anansix

USA . 1,100 parts In-Stock

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1,100

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 16,857 parts In-Stock

1+ parts

$0.100

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16,857

$0.100

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Ampacity Inc.

Singapore . 1,476 parts In-Stock

1+ parts

$0.111

100+ parts

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1,476

$0.111

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Corphita

USA . 1,569 parts In-Stock

1+ parts

$0.117

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1,569

$0.117

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Microchip USA

USA . 448 parts In-Stock

1+ parts

$0.492

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448

$0.492

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AZTECH Wire

Italy . 414 parts In-Stock

1+ parts

$14.010

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414

$14.010

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Netroflash

USA . 2,000 parts In-Stock

1+ parts

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100+ parts

$0.114

1k+ parts

$0.110

10k+ parts

$0.108

2,000

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$0.114

$0.110

$0.108

UNI Independent Distributors

Spain . 350 parts In-Stock

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350

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Overview

Discover the unparalleled quality and reliability of the NX1117CEADJZ,115 by NXP Semiconductors. This versatile regulator offers adjustable output voltage and superior load regulation, making it ideal for a wide range of applications. From automotive to industrial electronics, this product delivers unmatched performance and efficiency. Trust in NXP Semiconductors' reputation for cutting-edge technology and innovation, and experience the value and benefits that the NX1117CEADJZ,115 brings to your projects. Partner with NXP Semiconductors for the ultimate solution in semiconductor devices.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this regulator lightweight and durable, ideal for various applications.

Surface Mount: YES

With surface mount technology, this regulator can be easily and securely mounted on a PCB, saving space and simplifying assembly.

Technology: BIPOLAR

The bipolar technology used in this regulator ensures stable and reliable performance in regulating voltage.

Packing Method: TR

The tape and reel packing method makes it convenient for automated assembly processes, increasing efficiency.

Minimum Output Voltage: 1.25 V

This low minimum output voltage makes the regulator suitable for applications requiring precise voltage regulation.

No. of Terminals: 3

The three terminals provide easy connections and flexibility in circuit design.

Maximum Line Regulation: 0.02 %/V

The tight line regulation of 0.02% per volt ensures consistent performance even with varying input voltages.

Adjustability: ADJUSTABLE

The adjustable feature allows for fine-tuning of the output voltage, catering to different requirements.

Maximum Load Regulation: 0.4 %

The maximum load regulation of 0.4% ensures stable output voltage even under varying loads.

Terminal Finish: TIN

The tin terminal finish provides good conductivity and corrosion resistance, ensuring reliable connections.

Maximum Output Voltage: 18.8 V

With a maximum output voltage of 18.8V, this regulator can power a wide range of devices and components.

Maximum Output Current: 0.8 A

The high maximum output current of 0.8A allows for powering multiple components or devices simultaneously.

Maximum Time At Peak Reflow Temperature: 30s

The regulator can withstand peak reflow temperatures for up to 30 seconds, ensuring robustness during assembly processes.

Peak Reflow Temperature: 260°C

The peak reflow temperature of 260°C indicates the regulator's ability to endure high-temperature soldering processes.

Nominal Dropout Voltage: 1.07 V

The low nominal dropout voltage of 1.07V minimizes power loss and ensures efficient operation.

Technical Specifications

Other Function Regulators NX1117CEADJZ,115 attributes and parameters. Explore more Other Function Regulators devices from NXP Semiconductors

Specs

Adjustability:

ADJUSTABLE

Nominal Dropout Voltage-1:

1.07 V

JESD-609 Code:

e3

Maximum Line Regulation (%/V):

.02

Maximum Load Regulation (%):

.4 %

Moisture Sensitivity Level (MSL):

1

No. of Outputs:

1

No. of Terminals:

3

Maximum Output Current-1:

.8 A

Maximum Output Voltage-1:

18.8 V

Minimum Output Voltage-1:

1.25 V

Package Body Material:

PLASTIC/EPOXY

Package Equivalence Code:

SOT-223

Packing Method:

TR

Peak Reflow Temperature (C):

260

Qualification Status:

Not Qualified

Sub-Category:

Other Regulators

Surface Mount:

YES

Technology:

BIPOLAR

Terminal Finish:

TIN

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

NX1117CEADJZ,115 Regulators trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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