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NCX8200UKZ

NXP Semiconductors

NCX8200UKZ by NXP Semiconductors

NCX8200UKZ by NXP Semiconductors is a compact consumer IC designed for surface mount applications. It operates b/w -40 °C and 85 °C, with a supply voltage range of 1.6V to 3.6V. Its fine pitch and thin profile make it ideal for space-constrained designs.

Median Price

$0.376

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 16,000 parts In-Stock

1+ parts

-

100+ parts

$0.362

1k+ parts

$0.301

10k+ parts

$0.268

16,000

-

$0.362

$0.301

$0.268

DigiKey

USA . 16,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.450

10k+ parts

-

16,000

-

-

$0.450

-

Verical

USA . 12,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.376

10k+ parts

$0.335

12,000

-

-

$0.376

$0.335

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 574 parts In-Stock

1+ parts

$0.281

100+ parts

-

1k+ parts

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10k+ parts

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574

$0.281

-

-

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Vyrian

USA . 12,410 parts In-Stock

1+ parts

-

100+ parts

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12,410

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Anansix

USA . 909 parts In-Stock

1+ parts

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909

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,009 parts In-Stock

1+ parts

$0.266

100+ parts

-

1k+ parts

-

10k+ parts

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3,009

$0.266

-

-

-

AZTECH Wire

Italy . 511 parts In-Stock

1+ parts

$13.660

100+ parts

-

1k+ parts

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10k+ parts

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511

$13.660

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Metaverse IC Inc.

Canada . 100,794 parts In-Stock

1+ parts

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100+ parts

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100,794

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QUARKTWIN TECHNOLOGY LTD

USA . 17,748 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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17,748

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A-Z Elektronik GmbH

Germany . 7,340 parts In-Stock

1+ parts

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7,340

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Microchip USA

USA . 5,366 parts In-Stock

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5,366

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UNI Independent Distributors

Spain . 3,656 parts In-Stock

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3,656

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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3,000

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Overview

Unlock the potential of your designs with the NCX8200UKZ from NXP Semiconductors, a trusted leader in innovative technology. This high-performance consumer IC boasts superior quality and reliability, making it ideal for diverse applications like smart appliances, wearable devices, and IoT solutions. Its compact design and robust temperature range ensure seamless integration, delivering exceptional value and efficiency to elevate your products above the competition. Empower your innovations today!

Feature Benefit Bullets

Surface Mount: YES

The surface mount feature allows for easier integration into compact electronic devices, saving board space and enabling higher-density layouts.

Package Shape: SQUARE

A square package shape enhances flexibility in PCB layout and improves thermal performance due to uniform heat distribution.

General IC Type: CONSUMER CIRCUIT

Designed specifically for consumer applications, ensuring reliability and efficiency in everyday devices.

No. of Terminals: 9

With 9 terminals, this IC offers multiple connection options, facilitating versatile circuit designs.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

The very thin profile and fine pitch design aid in achieving high-density assemblies while accommodating various modern PCB designs.

Maximum Operating Temperature: 85 °C

A wide maximum operating temperature ensures reliable performance across a range of environments, making it suitable for consumer electronics.

Minimum Operating Temperature: -40 °C

The capability to operate at low temperatures enhances the reliability of the product in outdoor and extreme conditions.

Terminal Position: BOTTOM

Bottom terminal positioning helps minimize the footprint and allows for efficient placement on PCBs, enhancing layout design.

Maximum Seated Height: 0.54 mm

The low seated height contributes to a slim profile, making it perfect for space-constrained applications.

Width: 1.22 mm

The compact width facilitates placement in tight spaces, ideal for portable consumer electronics.

Minimum Supply Voltage (Vsup): 1.6 V

Low minimum supply voltage supports power-efficient designs, contributing to longer battery life in handheld devices.

Peak Reflow Temperature °C: 260

The high peak reflow temperature maximizes soldering reliability during assembly processes, essential for high-volume manufacturing.

Length: 1.22 mm

The compact length is conducive to space-saving designs, aiding in the development of miniaturized consumer products.

Terminal Form: BALL

Ball terminal form enhances electrical connections and improves mechanical stability in the solder joint.

Terminal Pitch: 0.4 mm

The fine terminal pitch allows for more terminals within a small area, facilitating complex circuit designs in smaller devices.

Maximum Supply Voltage (Vsup): 3.6 V

A versatile maximum supply voltage allows compatibility with a wide range of power sources, making it suitable for various applications.

Technical Specifications

Other Function Consumer ICs NCX8200UKZ attributes and parameters. Explore more Other Function Consumer ICs devices from NXP Semiconductors

Specs

General IC Type:

JESD-30 Code:

S-XBGA-B9

Length:

1.22 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

9

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

BGA9,3X3,16

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.54 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.6 V

Surface Mount:

YES

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Width:

1.22 mm

Trade Compliance

NCX8200UKZ General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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