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NCR401U

NXP Semiconductors

NCR401U by NXP Semiconductors

NCR401U by NXP Semiconductors is a small outline LED display driver with 6 terminals. It operates in temperatures ranging from -55 to 150°C, making it suitable for military-grade applications. The package is made of plastic/epoxy and features gull wing terminals for surface mounting.

Median Price

$0.127

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 42 parts In-Stock

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$0.127

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Chip Stock

USA . 112,000 parts In-Stock

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Digiode

USA . 2,791 parts In-Stock

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Anansix

USA . 2,451 parts In-Stock

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Vyrian

USA . 1,918 parts In-Stock

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Distributors (Availability)

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Argo Parts USA

USA . 5,132 parts In-Stock

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$0.127

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$0.123

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$0.123

Continental Prestige Electronics

USA . 4,373 parts In-Stock

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$0.127

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$0.124

4,373

$0.127

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Netroflash

USA . 1,000 parts In-Stock

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$0.127

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$0.124

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AZTECH Wire

Italy . 4,116 parts In-Stock

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$14.894

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Ampacity Inc.

Singapore . 1,359 parts In-Stock

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$16.500

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One Stop Electronics

USA . 317 parts In-Stock

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$24.500

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UNI Independent Distributors

Spain . 8,152 parts In-Stock

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Corphita

USA . 2,947 parts In-Stock

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Supply Digital

USA . 1,388 parts In-Stock

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Overview

Enhance your display performance with the NCR401U by NXP Semiconductors, a top-quality Graphics Display Driver that promises reliability and innovation. Manufactured by a trusted leader in semiconductor technology, this product offers unparalleled value and benefits for a wide range of applications. With its compact design and military-grade temperature grade, the NCR401U ensures optimal performance in any setting. Upgrade your display systems today and experience the advantages of cutting-edge technology with NXP Semiconductors.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides good insulation and protection for the internal components of the driver, ensuring reliability and durability.

Surface Mount: YES

Surface mount capability makes installation easier and more flexible in various applications, saving space and simplifying PCB design.

Screening Level: AEC-Q101

AEC-Q101 screening level ensures high reliability and quality standards, making this driver suitable for automotive applications with strict requirements.

Maximum Operating Temperature: 150 °C

High maximum operating temperature allows the driver to operate reliably in harsh environments without overheating, ensuring continuous performance.

Minimum Operating Temperature: -55 °C

Low minimum operating temperature enables the driver to function in cold conditions, making it versatile for use in a wide range of environments.

Terminal Pitch: 0.95 mm

Fine terminal pitch allows for a compact design and efficient use of PCB space, making this driver suitable for small footprint applications.

Technical Specifications

Graphics Display Drivers NCR401U attributes and parameters. Explore more Graphics Display Drivers devices from NXP Semiconductors

Specs

Interface IC Type:

JESD-30 Code:

R-PDSO-G6

Length:

2.9 mm

No. of Functions:

1

No. of Segments:

1

No. of Terminals:

6

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Screening Level:

AEC-Q101

Maximum Seated Height:

1.1 mm

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Width:

1.5 mm

Trade Compliance

NCR401U Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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