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MPXD2020VVU125

NXP Semiconductors

MPXD2020VVU125 by NXP Semiconductors

MPXD2020VVU125 by NXP Semiconductors is a CMOS microcontroller with 2097152 ROM words. It has a peak reflow temperature of 260°C and can withstand up to 40 seconds at this temperature. This microcontroller is ideal for applications requiring high processing power and reliability in various electronic devices.

Median Price

$21.078

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 1,000 parts In-Stock

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$21.078

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$21.078

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Anansix

USA . 1,620 parts In-Stock

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Digiode

USA . 1,477 parts In-Stock

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Vyrian

USA . 346 parts In-Stock

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346

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Distributors (Availability)

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AZTECH Wire

Italy . 346 parts In-Stock

1+ parts

$6.030

100+ parts

$5.790

1k+ parts

$5.680

10k+ parts

$5.560

346

$6.030

$5.790

$5.680

$5.560

Netroflash

USA . 100 parts In-Stock

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$21.078

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$20.024

10k+ parts

$19.603

100

$21.078

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$20.024

$19.603

Ampacity Inc.

Singapore . 883 parts In-Stock

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$23.000

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883

$23.000

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One Stop Electronics

USA . 1,237 parts In-Stock

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$29.000

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Microchip USA

USA . 145 parts In-Stock

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$39.908

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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Futuretech Components

Singapore . 2,555 parts In-Stock

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Corphita

USA . 2,111 parts In-Stock

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UNI Independent Distributors

Spain . 2,106 parts In-Stock

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Vigor

Singapore . 653 parts In-Stock

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Overview

Experience the cutting-edge technology of the MPXD2020VVU125 microcontroller by NXP Semiconductors, a trusted leader in semiconductor manufacturing. This versatile device is perfect for a wide range of applications, offering unmatched performance and reliability. With its advanced features and high-quality design, the MPXD2020VVU125 delivers exceptional value and benefits to customers looking to elevate their projects to the next level. Trust NXP Semiconductors to provide you with the best-in-class microcontrollers for all your needs.

Feature Benefit Bullets

Terminal Finish: TIN SILVER

This terminal finish provides excellent conductivity and corrosion resistance, ensuring reliable connections.

ROM Words: 2097152

With a high ROM capacity, this microcontroller can store a large amount of program data for complex applications.

Maximum Time At Peak Reflow Temperature (s): 40

This short reflow time minimizes the risk of damage to the microcontroller during the assembly process.

Peak Reflow Temperature °C: 260

The high peak reflow temperature allows for thorough soldering, ensuring strong and reliable connections.

Peripheral IC Type: MICROCONTROLLER

As a microcontroller, this product is versatile and can be used in a wide range of electronic devices and systems.

Technology: CMOS

The CMOS technology used in this microcontroller offers low power consumption and high noise immunity, making it energy-efficient and reliable.

Moisture Sensitivity Level (MSL): 3

With a moisture sensitivity level of 3, this microcontroller can withstand moderate exposure to moisture during handling and storage.

Technical Specifications

Microcontrollers MPXD2020VVU125 attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

JESD-609 Code:

e2

Moisture Sensitivity Level (MSL):

3

Peak Reflow Temperature (C):

260

ROM Words:

2097152

Technology:

CMOS

Terminal Finish:

TIN SILVER

Maximum Time At Peak Reflow Temperature (s):

40

Peripheral IC Type:

Trade Compliance

MPXD2020VVU125 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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