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MPXC2012DTI

NXP Semiconductors

MPXC2012DTI by NXP Semiconductors

PRESSURE SENSOR,PIEZORESISTIVE; Mounting Feature: THROUGH HOLE MOUNT; Output Type: ANALOG VOLTAGE; Package Shape or Style: RECTANGULAR; Output Range: 0-25mV; Body Width: 3.68 inch;

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,584 parts In-Stock

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3,584

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Digiode

USA . 1,162 parts In-Stock

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1,162

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Anansix

USA . 206 parts In-Stock

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206

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,034 parts In-Stock

1+ parts

$43.750

100+ parts

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1,034

$43.750

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UNI Independent Distributors

Spain . 7,276 parts In-Stock

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7,276

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Corphita

USA . 4,897 parts In-Stock

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Technical Specifications

Pressure Sensors MPXC2012DTI attributes and parameters. Explore more Pressure Sensors devices from NXP Semiconductors

Specs

Additional Features:

SENSITIVITY 2.5 MILLI VOLT PER KILO PASCAL, TEMPERATURE COMPENSATED

Body Width:

3.68 inch

Body Height:

9.14 mm

Body Length/Diameter:

6.35 mm

Linearity (%):

1

Mounting Feature:

Nominal Offset:

0MV

Maximum Operating Current:

6 mA

Maximum Operating Temperature:

40 Cel

Minimum Operating Temperature:

15 Cel

Output Range:

Output Type:

Package Shape or Style:

Port Type:

HOLE

Maximum Pressure Range:

1.45 Psi

Minimum Pressure Range:

0 Psi

Pressure Sensing Mode:

DIFFERENTIAL

Response Time:

1000 us

Sensitivity (mV/V):

2.5 mV/V

Sensors or Transducers Type:

Maximum Supply Voltage:

10 V

Termination Type:

SOLDER

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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