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MPL3150A2ST1

NXP Semiconductors

MPL3150A2ST1 by NXP Semiconductors

PRESSURE SENSOR,PIEZORESISTIVE; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: RECTANGULAR; Output Range: 0.10-0.90V; No. of Bits: 20;

Median Price

$2.571

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Verical

USA . 10,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

$2.571

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10,000

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$2.571

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Flip Electronics (Authorized)

USA . 9,000 parts In-Stock

1+ parts

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9,000

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Flip Electronics

USA . 9,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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9,000

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Digiode

USA . 3,226 parts In-Stock

1+ parts

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3,226

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Vyrian

USA . 3,058 parts In-Stock

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3,058

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Anansix

USA . 166 parts In-Stock

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166

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 283 parts In-Stock

1+ parts

$12.290

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283

$12.290

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Component Stockers USA

USA . 2,757 parts In-Stock

1+ parts

$39.580

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2,757

$39.580

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Corphita

USA . 4,179 parts In-Stock

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4,179

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UNI Independent Distributors

Spain . 75 parts In-Stock

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75

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Technical Specifications

Pressure Sensors MPL3150A2ST1 attributes and parameters. Explore more Pressure Sensors devices from NXP Semiconductors

Specs

Additional Features:

IT HAS I/O SUPPLY VOLTAGE 1.62 TO 3.6 V

Body Width:

3 inch

Body Height:

1.1 mm

Body Length/Diameter:

5 mm

Mounting Feature:

No. of Bits:

20

Maximum Operating Current:

.04 mA

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Interface Type:

I2C INTERFACE

Output Range:

Output Type:

Package Shape or Style:

Port Type:

HOLE

Maximum Pressure Range:

21.7557 Psi

Minimum Pressure Range:

7.25189 Psi

Pressure Sensing Mode:

ABSOLUTE

Response Time:

1000000 us

Sensors or Transducers Type:

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.95 V

Termination Type:

SOLDER

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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