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MP3V5010GVP

NXP Semiconductors

MP3V5010GVP by NXP Semiconductors

PRESSURE SENSOR,PIEZORESISTIVE; Mounting Feature: SURFACE MOUNT; Output Type: ANALOG VOLTAGE; Package Shape or Style: SQUARE; Output Range: 0.1-3.1V; Maximum Operating Temperature: 125 Cel;

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,998 parts In-Stock

1+ parts

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6,998

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Anansix

USA . 1,361 parts In-Stock

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1,361

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Digiode

USA . 845 parts In-Stock

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845

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Advanced Electronics

New Zealand . 60 parts In-Stock

1+ parts

$2.771

100+ parts

$2.522

1k+ parts

$2.272

10k+ parts

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60

$2.771

$2.522

$2.272

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One Stop Electronics

USA . 1,401 parts In-Stock

1+ parts

$5.750

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1,401

$5.750

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AZTECH Wire

Italy . 967 parts In-Stock

1+ parts

$19.830

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967

$19.830

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Component Stockers USA

USA . 211 parts In-Stock

1+ parts

$99.990

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211

$99.990

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Corphita

USA . 4,648 parts In-Stock

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4,648

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UNI Independent Distributors

Spain . 1,082 parts In-Stock

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Technical Specifications

Pressure Sensors MP3V5010GVP attributes and parameters. Explore more Pressure Sensors devices from NXP Semiconductors

Specs

Additional Features:

TEMPERATURE COMPENSATED; IT HAVE SENSITIVITY OF 270 MV/KPA

Body Width:

12.065 inch

Body Height:

7.365 mm

Body Length/Diameter:

12.065 mm

Housing:

PLASTIC

Mounting Feature:

Nominal Offset:

0.24V

Maximum Operating Current:

10 mA

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Range:

Output Type:

Package Shape or Style:

Port Type:

BARBED/HOLE

Maximum Pressure Range:

1.45 Psi

Minimum Pressure Range:

0 Psi

Pressure Sensing Mode:

GAGE

Response Time:

1000 us

Sensors or Transducers Type:

Maximum Supply Voltage:

3.3 V

Minimum Supply Voltage:

2.7 V

Termination Type:

SOLDER

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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