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MMA6260QR2

NXP Semiconductors

MMA6260QR2 by NXP Semiconductors

NXP Semiconductors' MMA6260QR2 is a 16-terminal chip carrier with a 3.3V supply voltage, operating b/w -20°C to 85°C. Ideal for analog circuits, it features a square package shape and matte tin terminal finish.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 4,469 parts In-Stock

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Vyrian

USA . 1,532 parts In-Stock

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Anansix

USA . 1,417 parts In-Stock

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Nova Conductors

Japan . 22 parts In-Stock

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One Stop Electronics

USA . 1,432 parts In-Stock

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$5.500

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$5.500

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Ampacity Inc.

Singapore . 1,215 parts In-Stock

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$6.500

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UNI Independent Distributors

Spain . 5,800 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,532 parts In-Stock

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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Metaverse IC Inc.

Canada . 4,932 parts In-Stock

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Corphita

USA . 3,311 parts In-Stock

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Continental Prestige Electronics

USA . 3,073 parts In-Stock

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Argo Parts USA

USA . 2,861 parts In-Stock

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Aranea Global

USA . 1,000 parts In-Stock

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Overview

Elevate your technology with the MMA6260QR2 from NXP Semiconductors, a leading manufacturer in the industry. This high-quality semiconductor offers unparalleled performance and reliability for a wide range of applications. With its surface mount design and innovative features, this product is a game-changer in the field of analog circuits. Experience the value and benefits that the MMA6260QR2 brings to your projects, from its superior functionality to its ease of use. Upgrade your devices today with NXP Semiconductors' cutting-edge technology.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient installation onto a circuit board, saving time and space in the overall design.

Nominal Supply Voltage (Vsup): 3.3 V

A stable nominal supply voltage of 3.3V ensures consistent performance and reliable operation of the semiconductor.

Package Style: CHIP CARRIER, HEAT SINK/SLUG

The package style with heat sink/slug allows for effective heat dissipation, ensuring the longevity and durability of the semiconductor.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, this semiconductor can withstand elevated temperatures, making it suitable for a variety of environments.

Minimum Supply Voltage (Vsup): 2.7 V

Having a low minimum supply voltage of 2.7V ensures flexibility in power supply options while still maintaining optimal performance.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260°C indicates that this semiconductor can withstand high-temperature soldering processes during manufacturing.

Moisture Sensitivity Level (MSL): 3

With a moisture sensitivity level of 3, this semiconductor can be safely stored and handled in typical factory environments without risk of moisture damage.

Technical Specifications

Other Function Semiconductors MMA6260QR2 attributes and parameters. Explore more Other Function Semiconductors devices from NXP Semiconductors

Specs

Other IC type:

JESD-30 Code:

S-XQCC-N16

JESD-609 Code:

e3

Length:

6 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC16,.23SQ,40

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

2.08 mm

Sub-Category:

Other Analog ICs

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

NO LEAD

Terminal Pitch:

1 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width (mm):

6 mm

Trade Compliance

MMA6260QR2 Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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