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MKS22FN128VLL12

NXP Semiconductors

MKS22FN128VLL12 by NXP Semiconductors

MICROCONTROLLER, RISC; Maximum Time At Peak Reflow Temperature (s): 40; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 3;

Median Price

$5.680

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 1,250 parts In-Stock

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$5.270

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$5.270

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Flip Electronics (Authorized)

USA . 1,250 parts In-Stock

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1,250

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Verical

USA . 1,040 parts In-Stock

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$6.090

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1,040

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$6.090

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Distributors (In-Stock)

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Vyrian

USA . 606 parts In-Stock

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$4.944

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Digiode

USA . 2,579 parts In-Stock

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Anansix

USA . 1,754 parts In-Stock

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Flip Electronics

USA . 1,250 parts In-Stock

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Nova Conductors

Japan . 10 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 1,054 parts In-Stock

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$4.200

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$4.200

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Microchip USA

USA . 1,763 parts In-Stock

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$19.092

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Corohmni

South Africa . 28 parts In-Stock

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$56.766

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GreenTree Electronics

Israel . 10,005 parts In-Stock

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UNI Independent Distributors

Spain . 7,451 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,937 parts In-Stock

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Argo Parts USA

USA . 2,470 parts In-Stock

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Corphita

USA . 859 parts In-Stock

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Continental Prestige Electronics

USA . 665 parts In-Stock

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Aranea Global

USA . 500 parts In-Stock

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500

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Technical Specifications

Microcontrollers MKS22FN128VLL12 attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

Moisture Sensitivity Level (MSL):

3

Peak Reflow Temperature (C):

260

Maximum Time At Peak Reflow Temperature (s):

40

Peripheral IC Type:

Trade Compliance

MKS22FN128VLL12 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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