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MKE02Z32VQH4

NXP Semiconductors

MKE02Z32VQH4 by NXP Semiconductors

MICROCONTROLLER, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 64; Package Code: QFP; Package Shape: SQUARE;

Median Price

$2.879

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 142 parts In-Stock

1+ parts

$5.940

100+ parts

$3.660

1k+ parts

$2.710

10k+ parts

$2.690

142

$5.940

$3.660

$2.710

$2.690

Flip Electronics (Authorized)

USA . 8,790 parts In-Stock

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DigiKey

USA . 390 parts In-Stock

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$2.830

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390

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$2.830

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Verical

USA . 390 parts In-Stock

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$2.879

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390

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$2.879

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Distributors (In-Stock)

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Vyrian

USA . 4,835 parts In-Stock

1+ parts

$2.220

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4,835

$2.220

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Bristol Electronics

USA . 49 parts In-Stock

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$3.794

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$1.897

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49

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$1.897

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Digiode

USA . 1,212 parts In-Stock

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$4.731

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Flip Electronics

USA . 8,790 parts In-Stock

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8,790

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Anansix

USA . 1,803 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 49 parts In-Stock

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Dan-Mar Components

USA . 49 parts In-Stock

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Distributors (Availability)

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One Stop Electronics

USA . 2,670 parts In-Stock

1+ parts

$1.890

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2,670

$1.890

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Corphita

USA . 1,063 parts In-Stock

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$4.482

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1,063

$4.482

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QUARKTWIN TECHNOLOGY LTD

USA . 15,629 parts In-Stock

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UNI Independent Distributors

Spain . 7,707 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,345 parts In-Stock

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Microchip USA

USA . 3,345 parts In-Stock

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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Perfect Parts

USA . 470 parts In-Stock

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470

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Cyclops Electronics Ltd (Excess)

UK . 84 parts In-Stock

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Glotronic Ltd.

UK . 67 parts In-Stock

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Technical Specifications

Microcontrollers MKE02Z32VQH4 attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Additional Features:

RAM SIZE CONSIDERED FROM THE MFR WEBSITE

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

20 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e3

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

57

No. of Terminals:

64

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

RAM Bytes:

4096

ROM Words:

32768

ROM Programmability:

FLASH

Speed:

40 rpm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.7 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

256

Connectivity:

I2C, SPI(2), UART(3)

Peripherals:

COMPARATOR(2), POR, PWM(10), RTC, TIMER(12), WDT

Analog To Digital Convertors:

16-Ch 12-Bit

Trade Compliance

MKE02Z32VQH4 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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