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MK60FN1M0VMD15

NXP Semiconductors

MK60FN1M0VMD15 by NXP Semiconductors

NXP Semiconductors' MK60FN1M0VMD15 microcontroller features a 60 MHz max clock frequency, 2-Ch 12-Bit DAC, and 4-Ch 16-Bit ADC. Ideal for industrial applications, it offers CAN(2), ETHERNET, I2C(3), SPI(3) connectivity options and includes peripherals like COMPARATOR(4) and DMA(32).

Median Price

$22.850

Lifecycle Status

Suppliers In-Stock

17

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 1,483 parts In-Stock

1+ parts

$17.290

100+ parts

$9.760

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1,483

$17.290

$9.760

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Chip1Stop

Japan . 640 parts In-Stock

1+ parts

$22.800

100+ parts

$14.000

1k+ parts

$13.300

10k+ parts

$13.100

640

$22.800

$14.000

$13.300

$13.100

Mouser Electronics

USA . 1,196 parts In-Stock

1+ parts

$22.850

100+ parts

$15.570

1k+ parts

$14.830

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1,196

$22.850

$15.570

$14.830

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DigiKey

USA . 1,043 parts In-Stock

1+ parts

$22.850

100+ parts

$17.145

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$14.823

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1,043

$22.850

$17.145

$14.823

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Newark

USA . 1,438 parts In-Stock

1+ parts

$23.060

100+ parts

$15.720

1k+ parts

$15.310

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1,438

$23.060

$15.720

$15.310

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Element14

Singapore . 1,438 parts In-Stock

1+ parts

$25.420

100+ parts

$19.910

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$25.420

$19.910

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Verical

USA . 1,600 parts In-Stock

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$14.678

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$14.678

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EBV Elektronik

Germany . 480 parts In-Stock

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480

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Avnet

USA . 160 parts In-Stock

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160

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Distrelec

Netherlands . 160 parts In-Stock

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160

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Distributors (In-Stock)

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Digiode

USA . 4,972 parts In-Stock

1+ parts

$16.406

100+ parts

-

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4,972

$16.406

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Nova Conductors

Japan . 500 parts In-Stock

1+ parts

$18.250

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500

$18.250

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Flip Electronics

USA . 245,163 parts In-Stock

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245,163

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Chip Stock

USA . 3,900 parts In-Stock

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3,900

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Anansix

USA . 2,065 parts In-Stock

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IBS Electronics

USA . 800 parts In-Stock

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$18.162

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800

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$18.162

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Vyrian

USA . 362 parts In-Stock

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362

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Distributors (Availability)

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Semicontronic

India . 425 parts In-Stock

1+ parts

$14.680

100+ parts

$14.313

1k+ parts

$14.240

10k+ parts

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425

$14.680

$14.313

$14.240

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Ampacity Inc.

Singapore . 421 parts In-Stock

1+ parts

$14.680

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421

$14.680

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Corphita

USA . 1,626 parts In-Stock

1+ parts

$15.543

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1,626

$15.543

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Continental Prestige Electronics

USA . 5,346 parts In-Stock

1+ parts

$18.175

100+ parts

-

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$17.811

5,346

$18.175

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$17.811

Aztec Data Supply Inc.

USA . 174 parts In-Stock

1+ parts

$20.805

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174

$20.805

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Advanced Electronics

New Zealand . 550 parts In-Stock

1+ parts

$49.280

100+ parts

$46.816

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$46.816

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550

$49.280

$46.816

$46.816

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Microchip USA

USA . 1,134 parts In-Stock

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$55.499

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Corohmni

South Africa . 161 parts In-Stock

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$74.157

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Modulus Dynamics

Lithuania . 2,552 parts In-Stock

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$85.138

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$85.138

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$85.138

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iodParts Technologies Inc.

India . 8,200 parts In-Stock

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Lixinc

USA . 3,583 parts In-Stock

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Futuretech Components

Singapore . 3,000 parts In-Stock

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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3,000

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Robosynatics

Brazil . 2,907 parts In-Stock

1+ parts

-

100+ parts

$72.849

1k+ parts

$71.363

10k+ parts

$71.363

2,907

-

$72.849

$71.363

$71.363

Lucentia Tech

USA . 2,907 parts In-Stock

1+ parts

-

100+ parts

$72.849

1k+ parts

$71.363

10k+ parts

$71.363

2,907

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$72.849

$71.363

$71.363

UNI Independent Distributors

Spain . 1,573 parts In-Stock

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Perfect Parts

USA . 896 parts In-Stock

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Argo Parts USA

USA . 733 parts In-Stock

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733

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Kepictronics

USA . 604 parts In-Stock

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Benley Electronics

USA . 160 parts In-Stock

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160

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Netroflash

USA . 100 parts In-Stock

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$17.885

1k+ parts

$17.338

10k+ parts

$16.972

100

-

$17.885

$17.338

$16.972

Overview

Enhance your electronic designs with the MK60FN1M0VMD15 microcontroller by NXP Semiconductors. This cutting-edge device offers unparalleled performance and reliability, making it a top choice for a wide range of applications. With advanced features like DAC and ADC channels, DMA support, and a maximum clock frequency of 60 MHz, this microcontroller is a versatile solution for industrial-grade projects. Trust in NXP Semiconductors' reputation for quality and innovation, and unlock the potential of your creations with the MK60FN1M0VMD15 microcontroller.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the microcontroller, ensuring a longer lifespan.

Surface Mount: YES

Allows for easy and efficient installation on circuit boards, saving time during production.

Maximum Supply Voltage: 3.6 V

Can support a wide range of applications and peripherals without the need for additional power management.

Package Shape: SQUARE

Saves space on the circuit board, making it ideal for compact designs.

DAC Channels: YES

Enables the microcontroller to generate analog signals, expanding its functionality.

Power Supplies (V): 1.8/3.3

Supports different voltage requirements, providing flexibility in designing various types of electronic devices.

No. of Terminals: 144

Offers a sufficient number of connection points for interfacing with other components and peripherals.

Package Style (Meter): GRID ARRAY

Facilitates easy mounting and soldering on the circuit board, improving production efficiency.

Minimum Supply Voltage: 1.71 V

Operates efficiently at low voltage, conserving power and extending battery life in portable devices.

Maximum Operating Temperature: 105 °C

Can withstand high temperatures, making it suitable for industrial and automotive applications.

CPU Family: CORTEX-M4

Features an advanced processor design for faster and more efficient data processing.

Minimum Operating Temperature: -40 °C

Functions reliably in cold environments, making it suitable for outdoor and automotive applications.

Terminal Finish: TIN SILVER COPPER

Provides corrosion resistance and reliable electrical connections for long-term performance.

ADC Channels: YES

Enables the microcontroller to convert analog signals into digital data, enhancing its input capabilities.

DMA Channels: YES

Supports Direct Memory Access for efficient data transfers, improving overall system performance.

Terminal Position: BOTTOM

Facilitates easier routing of connections on the circuit board, simplifying the layout design.

ROM Words: 1048576

Provides ample memory capacity for storing program instructions and data, accommodating complex applications.

Digital To Analog Convertors: 2-Ch 12-Bit

Allows for accurate generation of analog signals, essential for various types of sensors and actuators.

Width: 13 mm

Compact size enables the microcontroller to fit in tight spaces, suitable for miniaturized devices.

Peripherals: COMPARATOR(4), DMA(32), POR, RTC, TIMER(13)

Comprehensive set of peripherals for diverse interfacing and timing functions, enhancing the microcontroller's versatility.

Maximum Clock Frequency: 60 MHz

Offers high-speed processing capabilities, suitable for real-time applications and data-intensive tasks.

Maximum Time At Peak Reflow Temperature (s): 40

Ensures reliable soldering during production, minimizing defects and improving product quality.

Peak Reflow Temperature °C: 260

Can withstand high reflow temperatures during assembly processes, ensuring solder joint integrity.

Length: 13 mm

Compact dimensions make it suitable for space-constrained applications, such as wearables and IoT devices.

Temperature Grade: INDUSTRIAL

Designed to operate reliably in harsh industrial environments, offering durability and ruggedness.

Peripheral IC Type: MICROCONTROLLER, RISC

Utilizes a RISC architecture for efficient and streamlined data processing, enhancing overall performance.

RAM Bytes: 131072

Provides ample random access memory for temporary data storage, enabling multitasking and efficient operation.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high noise immunity, ideal for battery-operated devices.

Terminal Form: BALL

Ball grid array terminals provide reliable connections and enable high-density packaging, saving space on the circuit board.

Analog To Digital Convertors: 4-Ch 16-Bit

Delivers high-resolution analog-to-digital conversion capabilities for precise sensor interfacing and data acquisition.

Maximum Supply Current: 210 mA

Capable of delivering sufficient current to power external components and peripherals, enhancing system integration.

Nominal Supply Voltage: 3.3 V

Standard voltage level for compatibility with a wide range of electronic devices and power sources.

PWM Channels: YES

Supports Pulse Width Modulation for precise control of digital signals, essential for motor control and lighting applications.

Connectivity: CAN(2), ETHERNET, I2C(3), I2S(2), SPI(3), UART(6), USB

Versatile connectivity options for interfacing with various devices and peripherals, enhancing the microcontroller's versatility.

ROM Programmability: FLASH

Utilizes non-volatile flash memory for program storage, allowing for easy updates and reprogramming of firmware.

Terminal Pitch: 1 mm

Optimal terminal spacing for reliable solder connections and high-density packaging, improving overall system reliability.

Moisture Sensitivity Level (MSL): 3

Designed to withstand moderate levels of moisture exposure during assembly and operation, ensuring reliability in various environments.

Speed: 150 rpm

Capable of high-speed data processing and communication, suitable for applications that require rapid response times.

On Chip Program ROM Width: 8

Efficient use of on-chip memory for storing program instructions, optimizing code execution and system performance.

No. of I/O Lines: 100

Offers a sufficient number of input/output lines for interfacing with external devices and peripherals, enabling versatile system integration.

Technical Specifications

Microcontrollers MK60FN1M0VMD15 attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

0

CPU Family:

CORTEX-M4

Maximum Clock Frequency:

60 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B144

JESD-609 Code:

e1

Length:

13 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

100

No. of Terminals:

144

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA144,12X12,40

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8/3.3

Qualification:

Not Qualified

RAM Bytes:

131072

ROM Words:

1048576

ROM Programmability:

FLASH

Speed:

150 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

210 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

13 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN(2), ETHERNET, I2C(3), I2S(2), SPI(3), UART(6), USB

Peripherals:

COMPARATOR(4), DMA(32), POR, RTC, TIMER(13)

Analog To Digital Convertors:

4-Ch 16-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

MK60FN1M0VMD15 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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