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MK30DN512VLQ10

NXP Semiconductors

MK30DN512VLQ10 by NXP Semiconductors

NXP Semiconductors' MK30DN512VLQ10 microcontroller features a 32-bit CPU, 144 terminals, and 1.8/3.3 V power supplies. Ideal for industrial applications with its -40 to 105 °C operating temperature range, it offers DAC and ADC channels along with DMA support for efficient data processing at up to 32 MHz clock frequency.

Median Price

$15.920

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

MK30DN512VLQ10 by NXP Semiconductors
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Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 180 parts In-Stock

1+ parts

$6.750

100+ parts

$6.620

1k+ parts

$6.480

10k+ parts

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180

$6.750

$6.620

$6.480

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Arrow

USA . 1,000 parts In-Stock

1+ parts

$15.920

100+ parts

$12.330

1k+ parts

-

10k+ parts

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1,000

$15.920

$12.330

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Verical

USA . 1,000 parts In-Stock

1+ parts

$15.920

100+ parts

$12.330

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-

10k+ parts

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1,000

$15.920

$12.330

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DigiKey

USA . 290 parts In-Stock

1+ parts

$19.740

100+ parts

$13.975

1k+ parts

$12.743

10k+ parts

-

290

$19.740

$13.975

$12.743

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,446 parts In-Stock

1+ parts

$11.422

100+ parts

-

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3,446

$11.422

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Vyrian

USA . 3,191 parts In-Stock

1+ parts

$12.023

100+ parts

-

1k+ parts

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3,191

$12.023

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Anansix

USA . 1,539 parts In-Stock

1+ parts

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100+ parts

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1,539

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Nova Conductors

Japan . 50 parts In-Stock

1+ parts

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50

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Bristol Electronics

USA . 40 parts In-Stock

1+ parts

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40

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 2 parts In-Stock

1+ parts

$10.220

100+ parts

-

1k+ parts

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2

$10.220

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Corphita

USA . 4,894 parts In-Stock

1+ parts

$10.821

100+ parts

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4,894

$10.821

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Corohmni

South Africa . 478 parts In-Stock

1+ parts

$47.841

100+ parts

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1k+ parts

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478

$47.841

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QUARKTWIN TECHNOLOGY LTD

USA . 14,548 parts In-Stock

1+ parts

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14,548

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Microchip USA

USA . 3,053 parts In-Stock

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3,053

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

1+ parts

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3,000

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UNI Independent Distributors

Spain . 1,611 parts In-Stock

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1,611

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Netroflash

USA . 500 parts In-Stock

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500

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Perfect Parts

USA . 134 parts In-Stock

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134

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Overview

Unleash the power of innovation with the MK30DN512VLQ10 microcontroller by NXP Semiconductors. This cutting-edge device offers unparalleled performance and reliability, making it the perfect choice for a wide range of applications. Whether you're developing IoT devices, embedded systems, or industrial automation solutions, this microcontroller delivers the speed, efficiency, and flexibility you need to bring your ideas to life. Trust in NXP's legacy of excellence and unlock endless possibilities with the MK30DN512VLQ10.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the microcontroller, ensuring long-term reliability.

Surface Mount: YES

Allows for easy and efficient integration onto circuit boards, saving space and simplifying assembly.

Maximum Supply Voltage: 3.6 V

Supports a wide range of power supply options, making it versatile for different applications.

Package Shape: SQUARE

Efficient use of space on the circuit board, making it easier to fit into compact designs.

Bit Size: 32

Offers high computational power and performance for complex tasks and calculations.

DAC Channels: YES

Allows for accurate analog output, essential for applications like audio processing or sensor interfacing.

Power Supplies (V): 1.8/3.3

Supports multiple voltage options, providing flexibility and compatibility with different system requirements.

No. of Terminals: 144

Offers ample connectivity for interfacing with various external components and peripherals.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Enables a compact and streamlined design, ideal for space-constrained applications.

Minimum Supply Voltage: 1.71 V

Ensures efficient power usage and compatibility with low-voltage applications.

Maximum Operating Temperature: 105 °C

Can withstand high temperatures, suitable for industrial and demanding environments.

CPU Family: CORTEX-M4

Features a powerful and efficient CPU architecture, optimized for embedded systems and IoT applications.

Minimum Operating Temperature: -40 °C

Designed to operate in extreme cold environments, ensuring reliable performance in harsh conditions.

Terminal Finish: TIN

Provides good electrical conductivity and corrosion resistance for reliable connections.

ADC Channels: YES

Enables accurate analog-to-digital conversion, essential for reading sensor data and measurements.

DMA Channels: YES

Supports direct memory access for efficient data transfer and processing, improving overall system performance.

Terminal Position: QUAD

Facilitates easy integration and soldering onto the PCB, ensuring a reliable connection.

ROM Words: 524288

Offers large non-volatile memory for storing program code and data, suitable for complex applications.

Maximum Seated Height: 1.6 mm

Low profile design saves space and allows for compact device enclosure.

Width: 20 mm

Compact size enables integration into small form factor devices or systems.

Maximum Clock Frequency: 32 MHz

Provides high-speed processing capabilities for demanding applications and real-time tasks.

Maximum Time At Peak Reflow Temperature (s): 40

Ensures reliable soldering during manufacturing process, leading to a stable and durable product.

Peak Reflow Temperature °C: 260

Withstands high temperatures during assembly, ensuring proper soldering and component reliability.

Length: 20 mm

Compact form factor allows for space-efficient PCB layout and overall system design.

Temperature Grade: INDUSTRIAL

Designed to operate reliably in industrial settings with varying temperature conditions and environmental factors.

Peripheral IC Type: MICROCONTROLLER, RISC

Features a RISC architecture for efficient data processing and control, suitable for embedded applications.

RAM Bytes: 131072

Ample random-access memory for storing temporary data and variables during program execution.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high noise immunity, enhancing overall performance.

Terminal Form: GULL WING

Facilitates easy soldering onto the PCB with strong mechanical connections and good thermal performance.

Maximum Supply Current: 77 mA

Efficient power usage with low current consumption, ideal for battery-powered applications.

Nominal Supply Voltage: 3.3 V

Stable supply voltage for consistent operation and reliable performance in various applications.

PWM Channels: YES

Supports pulse-width modulation output for controlling motors, lights, and other devices with precise analog-like signals.

ROM Programmability: FLASH

Flash memory allows for easy program updates and storage of firmware, enhancing flexibility and longevity of the device.

Terminal Pitch: 0.5 mm

Fine pitch spacing enables high-density PCB design and miniaturization, suitable for compact electronic devices.

Moisture Sensitivity Level (MSL): 3

Resistant to moisture and humidity, ensuring reliability in various environmental conditions.

Speed: 100 rpm

Capable of high-speed operation for quick response times and efficient processing of data and commands.

No. of I/O Lines: 102

Offers a wide range of input/output options for interfacing with external devices and peripherals, enhancing connectivity and functionality.

Technical Specifications

Microcontrollers MK30DN512VLQ10 attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M4

Maximum Clock Frequency:

32 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G144

JESD-609 Code:

e3

Length:

20 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

102

No. of Terminals:

144

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP144,.87SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8/3.3

Qualification:

Not Qualified

RAM Bytes:

131072

ROM Words:

524288

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

100 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

77 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

20 mm

Peripheral IC Type:

Trade Compliance

MK30DN512VLQ10 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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