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MK21FX512AVMD12

NXP Semiconductors

MK21FX512AVMD12 by NXP Semiconductors

NXP Semiconductors' MK21FX512AVMD12 microcontroller features 144 terminals, 50 MHz clock frequency, and 3.6V max supply voltage. Ideal for industrial applications requiring a RISC-based microcontroller with FLASH ROM programmability and ADC/DAC channels for precise analog-to-digital conversions.

Median Price

$16.956

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1k+

MK21FX512AVMD12 by NXP Semiconductors
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USA . 4,185 parts In-Stock

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DigiKey

USA . 3,385 parts In-Stock

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$15.740

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Verical

USA . 3,300 parts In-Stock

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$18.172

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Nova Conductors

Japan . 33 parts In-Stock

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$13.817

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Cyclops Electronics Ltd

UK . 4,709 parts In-Stock

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Vyrian

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DigiKey Marketplace

USA . 3,385 parts In-Stock

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Digiode

USA . 1,775 parts In-Stock

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Anansix

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ACDS - Activité Composants Distribution Service

France . 160 parts In-Stock

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USA . 3,784 parts In-Stock

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Semicontronic

India . 3,585 parts In-Stock

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$13.046

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$12.979

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Ampacity Inc.

Singapore . 3,342 parts In-Stock

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$13.380

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Continental Prestige Electronics

USA . 4,412 parts In-Stock

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$13.817

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$13.541

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Microchip USA

USA . 2,389 parts In-Stock

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$35.324

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Aztec Data Supply Inc.

USA . 4,572 parts In-Stock

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Component Connect

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Authorized Procurement Solutions

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Perfect Parts

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GreenTree Electronics

Israel . 800 parts In-Stock

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Lixinc

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Component Stockers USA

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Bastille Electronics

Australia . 300 parts In-Stock

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Cyclops Electronics Ltd (Excess)

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Overview

Unlock endless possibilities with the MK21FX512AVMD12 by NXP Semiconductors, a microcontroller that combines cutting-edge technology with reliability. This versatile device is perfect for a wide range of applications, from industrial automation to consumer electronics. With its high-quality design and advanced features like DAC and ADC channels, this microcontroller offers exceptional value and performance. Trust NXP Semiconductors to deliver top-notch products that meet your needs and exceed your expectations. Experience the difference with the MK21FX512AVMD12.

Feature Benefit Bullets

Package Body Material

PLASTIC/EPOXY - This material provides durability and protection for the microcontroller, ensuring a long product lifespan.

Surface Mount

YES - Allows for easy and efficient installation on PCBs, saving time and effort during assembly.

Maximum Supply Voltage

3.6 V - Offers a wide range of supply voltage, making it compatible with various power sources.

Package Shape

SQUARE - Compact shape helps in saving space on the PCB, ideal for designs with size constraints.

DAC Channels

YES - Enables the microcontroller to convert digital signals into analog signals, expanding its functionality.

No. of Terminals

144 - Sufficient terminals for connecting to external components and peripherals, enhancing flexibility in design.

Package Style (Meter)

GRID ARRAY - Provides a sturdy and reliable package style, ensuring the microcontroller is protected from external elements.

Minimum Supply Voltage

1.71 V - Can operate at low voltage levels, suitable for power-constrained applications.

Maximum Operating Temperature

105 °C - Withstands high temperatures, making it suitable for industrial environments.

Minimum Operating Temperature

40 °C - Can function in extreme cold conditions, enhancing its versatility in different environments.

Terminal Finish

TIN SILVER COPPER - Ensures good electrical conductivity and corrosion resistance for reliable performance.

ADC Channels

YES - Allows the microcontroller to convert analog signals to digital, enabling various sensor interfacing options.

DMA Channels

YES - Facilitates efficient data transfer between memory and peripherals, improving overall system performance.

Terminal Position

BOTTOM - Easy access to terminals for soldering and connecting external components during assembly.

Width

13 mm - Compact width for space-saving designs, suitable for applications with size constraints.

Maximum Clock Frequency

50 MHz - High clock frequency for fast processing speeds, suitable for applications requiring quick data processing.

Maximum Time At Peak Reflow Temperature (s)

40 - Ensures proper reflow process during manufacturing, enhancing product reliability.

Peak Reflow Temperature °C

260 - Withstands high reflow temperatures during manufacturing processes without compromising performance.

Length

13 mm - Compact length for space-efficient designs, ideal for applications with limited PCB real estate.

Temperature Grade

INDUSTRIAL - Designed for industrial operating temperatures, ensuring reliable performance in harsh conditions.

Peripheral IC Type

MICROCONTROLLER, RISC - RISC architecture enhances processing efficiency and speed, suitable for performance-critical applications.

Technology

CMOS - Low power consumption and high noise immunity, making it ideal for battery-operated and noise-sensitive applications.

Terminal Form

BALL - Ball terminals provide good electrical contact and mechanical reliability, ensuring robust connections.

Nominal Supply Voltage

3.3 V - Standard supply voltage for compatibility with common power sources, simplifying power management.

PWM Channels

YES - Supports Pulse Width Modulation for precise control over connected devices, expanding application possibilities.

ROM Programmability

FLASH - Flash programmable ROM allows for easy firmware updates and customization, enhancing product flexibility.

Terminal Pitch

1 mm - Standard terminal pitch for easy integration with PCB layouts, simplifying design and assembly processes.

Moisture Sensitivity Level (MSL)

3 - MSL rating for proper handling and storage to prevent moisture-related damage, ensuring product reliability.

Speed

120 rpm - High operational speed for quick data processing and response times, suitable for time-critical applications.

No. of I/O Lines

95 - Sufficient I/O lines for connecting to external devices and peripherals, enabling versatile application possibilities.

Technical Specifications

Microcontrollers MK21FX512AVMD12 attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

0

Maximum Clock Frequency:

50 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B144

JESD-609 Code:

e1

Length:

13 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

95

No. of Terminals:

144

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

ROM Programmability:

FLASH

Speed:

120 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

13 mm

Peripheral IC Type:

Trade Compliance

MK21FX512AVMD12 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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