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MK10DX256ZVLQ10

NXP Semiconductors

MK10DX256ZVLQ10 by NXP Semiconductors

The NXP Semiconductors MK10DX256ZVLQ10 microcontroller features a 32-bit architecture, with DAC and ADC channels for precise analog signal processing. It operates at a clock frequency of up to 32 MHz, making it suitable for industrial applications requiring high-speed data processing. With a wide temperature range from -40°C to 105°C, this microcontroller is ideal for use in harsh environments where reliability is crucial.

Median Price

$16.770

Lifecycle Status

Suppliers In-Stock

14

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 280 parts In-Stock

1+ parts

$16.770

100+ parts

$11.459

1k+ parts

$10.665

10k+ parts

-

280

$16.770

$11.459

$10.665

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Mouser Electronics

USA . 191 parts In-Stock

1+ parts

$16.770

100+ parts

$11.460

1k+ parts

$10.660

10k+ parts

-

191

$16.770

$11.460

$10.660

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Flip Electronics (Authorized)

USA . 60 parts In-Stock

1+ parts

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60

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Verical

USA . 60 parts In-Stock

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100+ parts

$13.636

1k+ parts

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60

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$13.636

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,239 parts In-Stock

1+ parts

$10.621

100+ parts

-

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1,239

$10.621

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Bristol Electronics

USA . 134 parts In-Stock

1+ parts

$11.571

100+ parts

$8.100

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-

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134

$11.571

$8.100

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Nova Conductors

Japan . 300 parts In-Stock

1+ parts

$13.333

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300

$13.333

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Vyrian

USA . 2,488 parts In-Stock

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2,488

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Anansix

USA . 1,543 parts In-Stock

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1,543

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VRG Components

USA . 1,052 parts In-Stock

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1,052

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Chip Stock

USA . 141 parts In-Stock

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141

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Dan-Mar Components

USA . 134 parts In-Stock

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134

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J2 Sourcing AB

Sweden . 125 parts In-Stock

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Flip Electronics

USA . 60 parts In-Stock

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60

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Distributors (Availability)

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AZTECH Wire

Italy . 490 parts In-Stock

1+ parts

$6.899

100+ parts

-

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490

$6.899

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Ampacity Inc.

Singapore . 181 parts In-Stock

1+ parts

$9.500

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181

$9.500

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Semicontronic

India . 181 parts In-Stock

1+ parts

$9.500

100+ parts

$9.262

1k+ parts

$9.215

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181

$9.500

$9.262

$9.215

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Corphita

USA . 563 parts In-Stock

1+ parts

$10.062

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563

$10.062

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Continental Prestige Electronics

USA . 4,164 parts In-Stock

1+ parts

$13.333

100+ parts

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10k+ parts

$13.067

4,164

$13.333

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-

$13.067

Netroflash

USA . 50 parts In-Stock

1+ parts

$13.333

100+ parts

$13.067

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-

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50

$13.333

$13.067

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Corohmni

South Africa . 55 parts In-Stock

1+ parts

$36.593

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55

$36.593

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Aztec Data Supply Inc.

USA . 337 parts In-Stock

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$45.508

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337

$45.508

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Microchip USA

USA . 2,676 parts In-Stock

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$52.388

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2,676

$52.388

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Advanced Electronics

New Zealand . 15 parts In-Stock

1+ parts

$84.111

100+ parts

$79.905

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$79.905

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15

$84.111

$79.905

$79.905

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,513 parts In-Stock

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Argo Parts USA

USA . 2,330 parts In-Stock

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UNI Independent Distributors

Spain . 1,875 parts In-Stock

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Perfect Parts

USA . 739 parts In-Stock

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739

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Robosynatics

Brazil . 621 parts In-Stock

1+ parts

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$0.297

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$0.297

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$0.297

621

-

$0.297

$0.297

$0.297

Lucentia Tech

USA . 621 parts In-Stock

1+ parts

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$0.297

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$0.297

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$0.297

621

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$0.297

$0.297

$0.297

Overview

Unlock endless possibilities with the MK10DX256ZVLQ10 microcontroller from NXP Semiconductors. Designed with precision and innovation, this powerful device offers unparalleled performance and reliability. Ideal for a wide range of applications, this microcontroller is a game-changer in the industry. Experience seamless operation, enhanced functionality, and advanced features that will take your projects to the next level. Elevate your designs with the MK10DX256ZVLQ10 and see the difference it can make in your work.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and reliability for the package, making it suitable for various applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly, saving time and labor costs.

Maximum Supply Voltage: 3.6 V

Support for a maximum supply voltage of 3.6 V enables compatibility with a wide range of power sources.

Package Shape: SQUARE

Square package shape helps in efficient space utilization on the PCB layout.

Bit Size: 32

32-bit architecture provides high processing power and performance for computing tasks.

DAC Channels: YES

Digital-to-analog converter channels enable signal conversion for various analog applications.

No. of Terminals: 144

Having 144 terminals allows for versatile connectivity options and interfacing with external components.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

This package style offers a compact and low-profile design with fine pitch for space-constrained applications.

Minimum Supply Voltage: 1.71 V

Support for a low minimum supply voltage of 1.71 V ensures compatibility with low-power operation.

Maximum Operating Temperature: 105 °C

High maximum operating temperature of 105°C allows for reliable performance in harsh environments.

Minimum Operating Temperature: -40 °C

Wide range of minimum operating temperature (-40°C) ensures operation in extreme cold conditions.

Terminal Finish: TIN

TIN terminal finish provides good solderability and electrical conductivity.

ADC Channels: YES

Analog-to-digital converter channels enable precise analog signal measurements for a variety of applications.

DMA Channels: YES

Direct memory access channels allow for efficient data transfer and processing without CPU intervention.

Terminal Position: QUAD

Quad terminal position offers increased connectivity options and facilitates PCB routing.

Maximum Seated Height: 1.6 mm

Low maximum seated height of 1.6 mm helps in slim and compact device designs.

Width: 20 mm

20 mm width provides a balanced form factor for the package.

Maximum Clock Frequency: 32 MHz

High maximum clock frequency of 32 MHz enables fast and efficient operation for various applications.

Maximum Time At Peak Reflow Temperature (s): 40

With a maximum time of 40 seconds at peak reflow temperature, the product ensures reliable solder joint formation during assembly.

Peak Reflow Temperature °C: 260

Peak reflow temperature of 260°C allows for proper solder reflow and component attachment during assembly.

Length: 20 mm

20 mm length provides a compact form factor for the package.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable performance in demanding industrial environments.

Peripheral IC Type: MICROCONTROLLER, RISC

Microcontroller with RISC architecture offers high-performance computing capabilities for embedded applications.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity for efficient operation.

Terminal Form: GULL WING

Gull wing terminal form offers good mechanical strength and ease of solder joint inspection.

Nominal Supply Voltage: 3 V

Stable nominal supply voltage of 3 V ensures consistent and reliable performance.

PWM Channels: YES

Pulse width modulation channels enable precise control of analog signals for various applications.

ROM Programmability: FLASH

Flash ROM programmability allows for flexible software updates and customization of firmware.

Terminal Pitch: 0.5 mm

Fine terminal pitch of 0.5 mm enables high-density mounting and compact PCB designs.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates moderate sensitivity to moisture, requiring proper handling during storage and assembly.

Speed: 100 rpm

With a speed of 100 rpm, the product offers efficient data processing and execution for various tasks.

No. of I/O Lines: 100

Having 100 I/O lines provides versatile connectivity and interfacing options with external peripherals.

Technical Specifications

Microcontrollers MK10DX256ZVLQ10 attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

32 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G144

JESD-609 Code:

e3

Length:

20 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

100

No. of Terminals:

144

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

100 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

20 mm

Peripheral IC Type:

Trade Compliance

MK10DX256ZVLQ10 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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