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MK10DN64VFM5

NXP Semiconductors

MK10DN64VFM5 by NXP Semiconductors

NXP Semiconductors' MK10DN64VFM5 is a 32-bit microcontroller with Cortex-M4 CPU, 16384 bytes RAM, and 65536 ROM words. It operates at up to 50 MHz, has 10-Ch 16-Bit ADC channels, and offers connectivity via I2C, I2S, SPI, and UART(3). Ideal for industrial applications requiring high-speed processing and multiple peripherals.

Median Price

$5.620

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

MK10DN64VFM5 by NXP Semiconductors
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Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 10,380 parts In-Stock

1+ parts

$5.545

100+ parts

$3.317

1k+ parts

$3.037

10k+ parts

$2.927

10,380

$5.545

$3.317

$3.037

$2.927

DigiKey

USA . 1,930 parts In-Stock

1+ parts

$5.620

100+ parts

$3.598

1k+ parts

$3.235

10k+ parts

$3.127

1,930

$5.620

$3.598

$3.235

$3.127

Mouser Electronics

USA . 1,420 parts In-Stock

1+ parts

$5.620

100+ parts

$3.600

1k+ parts

$3.130

10k+ parts

$3.120

1,420

$5.620

$3.600

$3.130

$3.120

Chip1Stop

Japan . 780 parts In-Stock

1+ parts

$6.627

100+ parts

$3.147

1k+ parts

$2.806

10k+ parts

-

780

$6.627

$3.147

$2.806

-

Verical

USA . 10,380 parts In-Stock

1+ parts

-

100+ parts

$3.317

1k+ parts

$3.037

10k+ parts

$2.927

10,380

-

$3.317

$3.037

$2.927

Flip Electronics (Authorized)

USA . 490 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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490

-

-

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Distributors (In-Stock)

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Digiode

USA . 4,732 parts In-Stock

1+ parts

$5.064

100+ parts

-

1k+ parts

-

10k+ parts

-

4,732

$5.064

-

-

-

Anansix

USA . 2,467 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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2,467

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Vyrian

USA . 1,060 parts In-Stock

1+ parts

-

100+ parts

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1,060

-

-

-

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Flip Electronics

USA . 490 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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490

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Nova Conductors

Japan . 95 parts In-Stock

1+ parts

-

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95

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 748 parts In-Stock

1+ parts

$3.510

100+ parts

$3.422

1k+ parts

$3.405

10k+ parts

-

748

$3.510

$3.422

$3.405

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Ampacity Inc.

Singapore . 663 parts In-Stock

1+ parts

$3.510

100+ parts

-

1k+ parts

-

10k+ parts

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663

$3.510

-

-

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Corphita

USA . 1,300 parts In-Stock

1+ parts

$4.797

100+ parts

-

1k+ parts

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10k+ parts

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1,300

$4.797

-

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Component Stockers USA

USA . 3,045 parts In-Stock

1+ parts

$6.680

100+ parts

$4.280

1k+ parts

$3.530

10k+ parts

-

3,045

$6.680

$4.280

$3.530

-

Advanced Electronics

New Zealand . 50 parts In-Stock

1+ parts

$18.372

100+ parts

$17.454

1k+ parts

$17.454

10k+ parts

-

50

$18.372

$17.454

$17.454

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Microchip USA

USA . 1,536 parts In-Stock

1+ parts

$19.796

100+ parts

-

1k+ parts

-

10k+ parts

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1,536

$19.796

-

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Corohmni

South Africa . 209 parts In-Stock

1+ parts

$39.727

100+ parts

-

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10k+ parts

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209

$39.727

-

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Aztec Data Supply Inc.

USA . 251 parts In-Stock

1+ parts

$57.886

100+ parts

-

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251

$57.886

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Lixinc

USA . 17,862 parts In-Stock

1+ parts

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17,862

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iodParts Technologies Inc.

India . 8,200 parts In-Stock

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8,200

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UNI Independent Distributors

Spain . 5,433 parts In-Stock

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5,433

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Argo Parts USA

USA . 4,958 parts In-Stock

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4,958

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Perfect Parts

USA . 549 parts In-Stock

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549

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Continental Prestige Electronics

USA . 548 parts In-Stock

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548

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Bastille Electronics

Australia . 89 parts In-Stock

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89

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Overview

Unleash the power of innovation with the MK10DN64VFM5 by NXP Semiconductors, a cutting-edge microcontroller that promises unparalleled quality and reliability. Built by a trusted manufacturer in the industry, this device offers endless possibilities for various applications in sectors like automotive, consumer electronics, and industrial automation. With its advanced features and high-performance capabilities, customers can expect seamless integration, optimal functionality, and unmatched precision in their projects. Elevate your designs with the MK10DN64VFM5 and experience the ultimate value and benefits it brings to the table.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for compact, efficient placement on circuit boards, making it ideal for space-constrained applications.

Maximum Supply Voltage: 3.6 V

Higher maximum supply voltage allows for flexibility in power supply options and compatibility with a wide range of external components.

Package Shape: SQUARE

Square package shape ensures easy integration and placement on the PCB, optimizing space utilization.

Bit Size: 32

32-bit architecture provides enhanced processing capabilities, making it suitable for complex tasks and real-time applications.

Power Supplies (V): 1.8/3.3

Support for dual power supply voltages offers versatility in system design and compatibility with multiple power sources.

No. of Terminals: 32

Sufficient number of terminals for connecting to external components and peripherals, enabling versatile functionality.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Different package styles cater to various application needs, with options for heat dissipation and compact form factor.

Minimum Supply Voltage: 1.71 V

Low minimum supply voltage allows for operation in power-constrained environments while maintaining performance.

Maximum Operating Temperature: 105 °C

High maximum operating temperature ensures reliable operation in challenging environments and industrial applications.

CPU Family: CORTEX-M4

Use of Cortex-M4 CPU family ensures high performance, efficiency, and compatibility with a wide range of software development tools.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature extends the range of environments where the product can be deployed, including harsh conditions.

ADC Channels: YES

Integration of Analog-to-Digital Converters enables the product to interface with analog sensors and signals, expanding its applicability.

DMA Channels: YES

Direct Memory Access channels enhance data transfer speeds and efficiency, improving the overall performance of the product.

Terminal Position: QUAD

Quad terminal position offers ease of connection and compatibility with standard PCB designs, simplifying integration efforts.

ROM Words: 65536

Large ROM size provides ample storage for program instructions and data, allowing for complex software implementations.

Maximum Seated Height: 1 mm

Low seated height enables compact design assemblies, particularly suitable for applications with strict height constraints.

Width: 5 mm

Narrow width facilitates space-efficient placement on the PCB, optimizing board real estate for additional components.

Peripherals: COMPARATOR(2), DMA(4), RTC, TIMER(12)

Abundance of integrated peripherals expands the product's capabilities, providing support for precise timing, data transfer, and signal comparison tasks.

Maximum Clock Frequency: 50 MHz

High clock frequency allows for swift data processing and real-time responsiveness, suitable for demanding applications.

Maximum Time At Peak Reflow Temperature (s): 40

Extended time at peak reflow temperature enhances soldering reliability and robustness during manufacturing processes.

Peak Reflow Temperature °C: 260

High peak reflow temperature ensures proper soldering of the component onto the PCB, meeting industry standards for quality assembly.

Length: 5 mm

Compact length dimension contributes to overall space-saving design considerations, critical for miniaturized electronic devices.

Temperature Grade: INDUSTRIAL

Industrial temperature grade denotes robustness and reliability in harsh operating environments, suitable for industrial control systems.

Peripheral IC Type: MICROCONTROLLER, RISC

Utilization of RISC architecture in a microcontroller IC ensures efficient performance, low power consumption, and streamlined execution of tasks.

RAM Bytes: 16384

Sufficient RAM capacity for data storage and manipulation, supporting multi-tasking and data-intensive applications.

Technology: CMOS

CMOS technology represents a power-efficient design, enabling prolonged battery life and reduced heat generation in the product.

Terminal Form: NO LEAD

Lead-free terminal form complies with environmental regulations, ensuring eco-friendly manufacturing processes and end-product disposal.

Analog To Digital Convertors: 10-Ch 16-Bit

Integration of high-resolution ADCs enables accurate conversion of analog signals to digital data, critical for precise sensor interfacing.

Maximum Supply Current: 18.2 mA

Low supply current consumption ensures energy efficiency and extended battery life in portable or battery-operated devices.

Nominal Supply Voltage: 3.3 V

Standard nominal supply voltage allows for easy compatibility with common power supply configurations and components.

PWM Channels: YES

Pulse-width modulation channels enable precise control of digital signals, essential for applications requiring variable output voltages or motor speed adjustment.

Connectivity: I2C, I2S, SPI, UART(3)

Diverse connectivity options through I2C, I2S, SPI, and UART interfaces enhance the product's compatibility with external devices and communication protocols.

ROM Programmability: FLASH

Flash ROM programmability allows for easy firmware updates and flexible memory allocation, facilitating product customization and future enhancements.

Terminal Pitch: 0.5 mm

Fine terminal pitch enables dense PCB layouts and high I/O density, catering to space-constrained designs and miniaturized applications.

Moisture Sensitivity Level (MSL): 3

MSL level 3 signifies moderate moisture sensitivity during storage and handling, guiding proper precautions to maintain component reliability.

Speed: 50 rpm

50 rpm speed capability indicates support for time-sensitive applications or motor control tasks, delivering precise rotational speed control.

On Chip Program ROM Width: 8

On-chip ROM width of 8 bits allows for efficient storage of program instructions, ensuring streamlined execution and optimized memory utilization.

No. of I/O Lines: 24

Adequate number of I/O lines offer versatile connectivity options and interfacing capabilities, enabling integration with various external peripherals and sensors.

Technical Specifications

Microcontrollers MK10DN64VFM5 attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M4

Maximum Clock Frequency:

50 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-XQCC-N32

Length:

5 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

24

No. of Terminals:

32

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8/3.3

Qualification:

Not Qualified

RAM Bytes:

16384

ROM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

18.2 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

5 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C, I2S, SPI, UART(3)

Peripherals:

COMPARATOR(2), DMA(4), RTC, TIMER(12)

Analog To Digital Convertors:

10-Ch 16-Bit

Trade Compliance

MK10DN64VFM5 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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