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MCZ33903C5EKR2

NXP Semiconductors

MCZ33903C5EKR2 by NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; Temperature Grade: AUTOMOTIVE; No. of Terminals: 32; Package Code: HSSOP; Package Shape: RECTANGULAR; Surface Mount: YES;

Median Price

$5.050

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Verical

USA . 20,000 parts In-Stock

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Rochester

USA . 975 parts In-Stock

1+ parts

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$3.840

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$3.430

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$3.230

975

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$3.840

$3.430

$3.230

DigiKey

USA . 975 parts In-Stock

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$5.050

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975

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$5.050

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Farnell

UK . 975 parts In-Stock

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$5.220

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975

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$5.220

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Distributors (In-Stock)

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Digiode

USA . 2,792 parts In-Stock

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$4.066

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Vyrian

USA . 430 parts In-Stock

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$4.280

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Flip Electronics

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DigiKey Marketplace

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Anansix

USA . 893 parts In-Stock

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Distributors (Availability)

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Corphita

USA . 2,934 parts In-Stock

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$3.852

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$3.852

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Ampacity Inc.

Singapore . 5,516 parts In-Stock

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$7.920

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QUARKTWIN TECHNOLOGY LTD

USA . 28,347 parts In-Stock

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Microchip USA

USA . 5,445 parts In-Stock

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UNI Independent Distributors

Spain . 5,414 parts In-Stock

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Authorized Procurement Solutions

USA . 1,500 parts In-Stock

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Perfect Parts

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Kepictronics

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A-Z Elektronik GmbH

Germany . 288 parts In-Stock

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Technical Specifications

Power Management ICs MCZ33903C5EKR2 attributes and parameters. Explore more Power Management ICs devices from NXP Semiconductors

Specs

Adjustable Threshold:

YES

JESD-30 Code:

R-PDSO-G32

JESD-609 Code:

e3

Length:

11 mm

Moisture Sensitivity Level (MSL):

3

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

32

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

2.45 mm

Maximum Supply Voltage (Vsup):

28 V

Minimum Supply Voltage (Vsup):

5.5 V

Nominal Supply Voltage (Vsup):

10.5 V

Surface Mount:

YES

Technology:

MOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width (mm):

7.5 mm

Trade Compliance

MCZ33903C5EKR2 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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