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MC9RS08KA2CDB

NXP Semiconductors

MC9RS08KA2CDB by NXP Semiconductors

MC9RS08KA2CDB by NXP Semiconductors is an 8-bit microcontroller with a max supply voltage of 5.5V and ROM words of 2048. Ideal for industrial applications, it features a small outline package style and operates in temperatures ranging from -40 to 85°C.

Median Price

$1.356

Lifecycle Status

Suppliers In-Stock

18

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 2,050 parts In-Stock

1+ parts

$0.990

100+ parts

-

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2,050

$0.990

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Arrow

USA . 980 parts In-Stock

1+ parts

$1.371

100+ parts

$1.057

1k+ parts

$0.949

10k+ parts

-

980

$1.371

$1.057

$0.949

-

Mouser Electronics

USA . 2,533 parts In-Stock

1+ parts

$2.010

100+ parts

$1.220

1k+ parts

$1.050

10k+ parts

$1.030

2,533

$2.010

$1.220

$1.050

$1.030

DigiKey

USA . 1 parts In-Stock

1+ parts

$2.240

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1

$2.240

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Verical

USA . 9,800 parts In-Stock

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$1.131

9,800

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$1.131

Rochester

USA . 220 parts In-Stock

1+ parts

-

100+ parts

$1.340

1k+ parts

$1.110

10k+ parts

$0.992

220

-

$1.340

$1.110

$0.992

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 996 parts In-Stock

1+ parts

$1.045

100+ parts

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996

$1.045

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Nova Conductors

Japan . 34 parts In-Stock

1+ parts

$1.185

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34

$1.185

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Chip Stock

USA . 34,306 parts In-Stock

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34,306

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Cyclops Electronics Ltd

UK . 2,512 parts In-Stock

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2,512

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Anansix

USA . 2,373 parts In-Stock

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2,373

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Vyrian

USA . 1,173 parts In-Stock

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1,173

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Euro-Tech

UK . 980 parts In-Stock

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980

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AGACORP

USA . 490 parts In-Stock

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490

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Avant Electronics Limited

UK . 360 parts In-Stock

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360

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ComSIT Distribution GmbH

Germany . 124 parts In-Stock

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124

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Prism Electronics

USA . 3 parts In-Stock

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3

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Semi Source

USA . 1 parts In-Stock

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1

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 1,327 parts In-Stock

1+ parts

$0.940

100+ parts

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1k+ parts

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1,327

$0.940

-

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Semicontronic

India . 996 parts In-Stock

1+ parts

$0.940

100+ parts

$0.916

1k+ parts

$0.912

10k+ parts

-

996

$0.940

$0.916

$0.912

-

Corphita

USA . 4,305 parts In-Stock

1+ parts

$0.990

100+ parts

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4,305

$0.990

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Continental Prestige Electronics

USA . 6,799 parts In-Stock

1+ parts

$1.185

100+ parts

-

1k+ parts

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10k+ parts

$1.162

6,799

$1.185

-

-

$1.162

Argo Parts USA

USA . 808 parts In-Stock

1+ parts

$1.185

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808

$1.185

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Netroflash

USA . 50 parts In-Stock

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$1.185

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50

$1.185

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Microchip USA

USA . 1,774 parts In-Stock

1+ parts

$16.640

100+ parts

$16.540

1k+ parts

$16.490

10k+ parts

$16.440

1,774

$16.640

$16.540

$16.490

$16.440

Aztec Data Supply Inc.

USA . 190 parts In-Stock

1+ parts

$26.328

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190

$26.328

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GreenTree Electronics

Israel . 38,220 parts In-Stock

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38,220

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QUARKTWIN TECHNOLOGY LTD

USA . 29,354 parts In-Stock

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29,354

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Metaverse IC Inc.

Canada . 15,600 parts In-Stock

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15,600

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A-Z Elektronik GmbH

Germany . 14,685 parts In-Stock

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14,685

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Assy Fe

Spain . 4,900 parts In-Stock

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4,900

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Benley Electronics

USA . 3,068 parts In-Stock

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3,068

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Perfect Parts

USA . 2,443 parts In-Stock

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2,443

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Computer Components Inc. - USA

USA . 1,908 parts In-Stock

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1,908

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UNI Independent Distributors

Spain . 1,234 parts In-Stock

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1,234

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Authorized Procurement Solutions

USA . 500 parts In-Stock

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500

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Kepictronics

USA . 150 parts In-Stock

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150

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Overview

Unleash the power of innovation with the MC9RS08KA2CDB by NXP Semiconductors, a top-tier manufacturer known for cutting-edge technology. This microcontroller offers unparalleled quality and reliability, making it ideal for a wide range of applications. With a compact design and advanced features, this product provides exceptional value, delivering superior performance and efficiency to customers. Elevate your projects to new heights with the MC9RS08KA2CDB and experience the advantages of leading-edge technology at your fingertips.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and reliable PCB assembly, making it suitable for mass production and compact designs.

Maximum Supply Voltage: 5.5 V

Support for a maximum supply voltage of 5.5V provides flexibility in power supply options and compatibility with a wide range of applications.

Package Shape: SQUARE

Square package shape helps in efficient space utilization on PCB and allows for easier placement and routing of traces.

Bit Size: 8

8-bit architecture offers a good balance between performance and cost, suitable for many embedded applications.

Power Supplies (V): 1.8/5.5

Wide range of power supply options allows for versatile use in different scenarios and environments.

No. of Terminals: 6

Optimal number of terminals for connectivity while keeping the design compact and efficient.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

The small outline, heat sink/slug, and very thin profile package style helps in thermal management, space-saving, and compatibility with modern PCB designs.

Minimum Supply Voltage: 1.8 V

Support for a minimum supply voltage of 1.8V allows for low-power operation and extended battery life in portable devices.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliable performance even in challenging environmental conditions.

Minimum Operating Temperature: -40 °C

Wide temperature range support enables operation in extreme cold environments without compromising functionality.

Terminal Position: DUAL

Dual terminal positions provide flexibility in PCB layout and offer multiple options for connectivity.

ROM Words: 2048

Large ROM capacity allows for storing firmware, programs, and data, enabling complex applications to be implemented on the microcontroller.

Maximum Seated Height: 1 mm

Low maximum seated height reduces the overall profile of the device, enabling compact and slim designs.

Width: 3 mm

Compact width dimension allows for efficient placement of the microcontroller on the PCB, saving space for other components.

Maximum Time At Peak Reflow Temperature (s): 40

The maximum time at peak reflow temperature specification ensures proper soldering and reliability during the assembly process.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance ensures compatibility with lead-free soldering processes and industry-standard reflow profiles.

Length: 3 mm

Compact length dimension provides flexibility in PCB layout and placement options, especially in space-constrained designs.

Temperature Grade: INDUSTRIAL

Industrial temperature grade rating indicates reliability and stability in harsh operating conditions, making it suitable for industrial applications.

Peripheral IC Type: MICROCONTROLLER

Inclusion of microcontroller peripherals simplifies system design, reduces component count, and enhances overall functionality of the device.

RAM Bytes: 63

Adequate RAM capacity of 63 bytes allows for efficient data processing and storage, supporting a wide range of applications and tasks.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with modern digital systems, making it an energy-efficient choice for embedded applications.

Terminal Form: NO LEAD

No-lead terminal form factor ensures compatibility with lead-free soldering processes, environmental regulations, and industry standards.

Nominal Supply Voltage: 3 V

Stable nominal supply voltage of 3V simplifies power supply design and compatibility with common power sources.

ROM Programmability: FLASH

Flash ROM programmability allows for easy firmware updates, field upgrades, and customization of software, enhancing the flexibility and longevity of the microcontroller.

Terminal Pitch: 0.95 mm

Compact terminal pitch of 0.95mm enables high-density mounting on the PCB, saving space and facilitating efficient interconnection with other components.

Moisture Sensitivity Level (MSL): 3

Moisture sensitivity level 3 indicates resistance to moisture-related failures during manufacturing, storage, and operation, ensuring long-term reliability in various environments.

Speed: 20 rpm

Operating speed of 20 revolutions per minute (rpm) offers fast and efficient data processing capabilities, suitable for real-time applications and high-performance tasks.

No. of I/O Lines: 4

Adequate number of input/output lines (4) provide flexibility for connecting external devices, sensors, and peripherals, enabling versatile system integration and functionality.

Technical Specifications

Microcontrollers MC9RS08KA2CDB attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

NO

Address Bus Width:

0

Bit Size:

8

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-XDSO-N6

Length:

3 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

4

No. of Terminals:

6

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

SOLCC6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8/5.5

Qualification:

Not Qualified

RAM Bytes:

63

ROM Words:

2048

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

20 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

3 mm

Peripheral IC Type:

Trade Compliance

MC9RS08KA2CDB Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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