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MC56F8006VWLR

NXP Semiconductors

MC56F8006VWLR by NXP Semiconductors

MC56F8006VWLR by NXP: 16-bit microcontroller with 64MHz clock, 2048B RAM, and 16384 ROM words. Ideal for industrial applications requiring RISC-based processing, featuring ADC and DMA channels for efficient data handling. Operates b/w -40°C to 105°C with a supply voltage range of 1.8V to 3.3V.

Median Price

$4.309

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

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Nova Conductors

Japan . 66 parts In-Stock

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Vyrian

USA . 5,968 parts In-Stock

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Anansix

USA . 2,462 parts In-Stock

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Digiode

USA . 2,462 parts In-Stock

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Chip Stock

USA . 685 parts In-Stock

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Distributors (Availability)

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Vigor

Singapore . 998 parts In-Stock

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$3.000

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Ampacity Inc.

Singapore . 842 parts In-Stock

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Continental Prestige Electronics

USA . 3,374 parts In-Stock

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$4.309

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$4.222

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$4.222

Argo Parts USA

USA . 109 parts In-Stock

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AZTECH Wire

Italy . 543 parts In-Stock

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$16.533

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One Stop Electronics

USA . 1,497 parts In-Stock

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$18.000

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Microchip USA

USA . 3,101 parts In-Stock

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Advanced Electronics

New Zealand . 5,000 parts In-Stock

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$53.004

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$48.234

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$43.463

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QUARKTWIN TECHNOLOGY LTD

USA . 12,078 parts In-Stock

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UNI Independent Distributors

Spain . 7,885 parts In-Stock

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A-Z Elektronik GmbH

Germany . 2,411 parts In-Stock

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Corphita

USA . 2,269 parts In-Stock

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Perfect Parts

USA . 2,240 parts In-Stock

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Metaverse IC Inc.

Canada . 1,607 parts In-Stock

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Netroflash

USA . 1,000 parts In-Stock

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$4.222

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$4.093

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$4.007

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Authorized Procurement Solutions

USA . 650 parts In-Stock

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Overview

Unlock the power of innovation with the MC56F8006VWLR by NXP Semiconductors, a cutting-edge microcontroller that delivers unrivaled performance and reliability. Designed with precision and expertise, this versatile device is perfect for a wide range of applications in various industries. From automotive to industrial automation, this microcontroller offers unmatched value, benefits, and advantages to customers seeking top-notch quality and seamless functionality. Experience the difference with NXP Semiconductors and take your projects to new heights with the MC56F8006VWLR.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides a durable and lightweight housing for the microcontroller.

Surface Mount: YES

Allows for easy and efficient mounting on circuit boards.

Maximum Supply Voltage: 3.6 V

Provides flexibility in power supply options for various applications.

Package Shape: RECTANGULAR

Simplifies the integration of the microcontroller into circuit designs.

Bit Size: 16

Offers a good balance between processing power and efficiency.

Power Supplies (V): 3.3

Standard voltage for compatibility with various electrical systems.

No. of Terminals: 28

Provides ample connectivity options for interfacing with other components.

Package Style: SMALL OUTLINE

Saves space on the circuit board, making it ideal for compact designs.

Minimum Supply Voltage: 1.8 V

Ensures reliable operation even at lower voltage levels.

Maximum Operating Temperature: 105 °C

Suitable for use in industrial environments with high temperature requirements.

CPU Family: 56800E

Part of a well-established and reliable line of microcontrollers.

Minimum Operating Temperature: -40 °C

Can withstand extreme cold temperatures for versatile usage scenarios.

Terminal Finish: TIN

Provides a durable and corrosion-resistant finish for the terminals.

ADC Channels: YES

Allows for analog-to-digital conversion for sensor interfacing and measurement.

DMA Channels: YES

Enables efficient data transfer between peripherals without CPU intervention.

Terminal Position: DUAL

Facilitates easy soldering and connection of the microcontroller.

ROM Words: 16384

Offers ample storage capacity for program and data memory.

Maximum Seated Height: 2.65 mm

Low profile design for slim and compact devices.

Width: 7.5 mm

Compact size for space-constrained applications.

Maximum Clock Frequency: 64 MHz

Provides fast processing speed for real-time applications.

Maximum Time At Peak Reflow Temperature (s): 40

Allows for efficient solder reflow processes during manufacturing.

Peak Reflow Temperature °C: 260

Withstands high-temperature soldering processes for reliability.

Length: 17.925 mm

Optimal size for easy integration into circuit board layouts.

Temperature Grade: INDUSTRIAL

Designed to operate reliably in harsh industrial environments.

Peripheral IC Type: MICROCONTROLLER, RISC

Utilizes efficient RISC architecture for streamlined processing.

RAM Bytes: 2048

Sufficient random access memory for data processing and storage.

Technology: CMOS

Energy-efficient CMOS technology for low power consumption.

Terminal Form: GULL WING

Facilitates reliable solder connections for robust circuit assembly.

Nominal Supply Voltage: 3.3 V

Stable voltage supply for consistent performance.

PWM Channels: YES

Supports pulse width modulation for precise control of outputs.

ROM Programmability: FLASH

Easy reprogramming of the ROM for firmware updates and customization.

Terminal Pitch: 1.27 mm

Standard pitch for compatibility with soldering equipment.

Moisture Sensitivity Level (MSL): 3

Suitable for reflow soldering processes with moderate moisture sensitivity.

Speed: 32 rpm

Efficient processing speed for various applications.

No. of I/O Lines: 23

Sufficient input/output lines for connecting to external devices.

Technical Specifications

Microcontrollers MC56F8006VWLR attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

CPU Family:

56800E

Maximum Clock Frequency:

64 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e3

Length:

17.925 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

23

No. of Terminals:

28

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP28,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

2048

ROM Words:

16384

ROM Programmability:

FLASH

Maximum Seated Height:

2.65 mm

Speed:

32 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

7.5 mm

Peripheral IC Type:

Trade Compliance

MC56F8006VWLR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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