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MC17XSG500BEK

NXP Semiconductors

MC17XSG500BEK by NXP Semiconductors

BUFFER OR INVERTER BASED PERIPHERAL DRIVER; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 32; Package Code: HSSOP; Package Shape: RECTANGULAR;

Median Price

$6.961

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Verical

USA . 9,996 parts In-Stock

1+ parts

-

100+ parts

$6.961

1k+ parts

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10k+ parts

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9,996

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$6.961

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,891 parts In-Stock

1+ parts

-

100+ parts

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10k+ parts

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2,891

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-

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Digiode

USA . 1,885 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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1,885

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Anansix

USA . 462 parts In-Stock

1+ parts

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100+ parts

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462

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Flip Electronics

USA . 232 parts In-Stock

1+ parts

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232

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 537 parts In-Stock

1+ parts

$20.500

100+ parts

-

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537

$20.500

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UNI Independent Distributors

Spain . 4,936 parts In-Stock

1+ parts

-

100+ parts

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4,936

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Corphita

USA . 2,642 parts In-Stock

1+ parts

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2,642

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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2,000

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Technical Specifications

Peripheral Drivers MC17XSG500BEK attributes and parameters. Explore more Peripheral Drivers devices from NXP Semiconductors

Specs

Additional Features:

ALSO OPERATES AT 7V TO 30V

Built-in Protections:

OVER CURRENT; THERMAL; UNDER VOLTAGE

Input Characteristics:

STANDARD

JESD-30 Code:

R-PDSO-G32

JESD-609 Code:

e3

Length:

11 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

32

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Current Flow Direction:

SINK

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP32,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

2.45 mm

Maximum Supply Current:

4 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Turn-off Time:

120000 us

Turn-on Time:

120000 us

Width:

7.5 mm

Trade Compliance

MC17XSG500BEK Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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