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LM75BGD

NXP Semiconductors

LM75BGD by NXP Semiconductors

NXP Semiconductors' LM75BGD is a temperature sensor with 11-bit resolution, operating from -55 to 125°C. It features a 2-wire interface, nickel palladium gold finish, and plastic housing. Ideal for applications requiring precise temperature monitoring in a compact form factor.

Median Price

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Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

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Chip Stock

USA . 91,150 parts In-Stock

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J2 Sourcing AB

Sweden . 6,069 parts In-Stock

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Anansix

USA . 1,153 parts In-Stock

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Vyrian

USA . 520 parts In-Stock

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Digiode

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389

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Ashlea Components Ltd

UK . 137 parts In-Stock

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Nova Conductors

Japan . 100 parts In-Stock

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Prism Electronics

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4 Star Electronics, Inc.

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Microchip USA

USA . 1,370 parts In-Stock

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$1.070

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Aztec Data Supply Inc.

USA . 120 parts In-Stock

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$2.120

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Corohmni

South Africa . 1,079 parts In-Stock

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AZTECH Wire

Italy . 393 parts In-Stock

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Ampacity Inc.

Singapore . 1,484 parts In-Stock

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One Stop Electronics

USA . 1,279 parts In-Stock

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Semicontronic

India . 866 parts In-Stock

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Kepictronics

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Lixinc

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A-Z Elektronik GmbH

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Corphita

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Alle Elektronik GmbH

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Continental Prestige Electronics

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Argo Parts USA

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UNI Independent Distributors

Spain . 290 parts In-Stock

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Bastille Electronics

Australia . 120 parts In-Stock

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Overview

Elevate your temperature sensing capabilities with the LM75BGD by NXP Semiconductors. Designed with precision and reliability in mind, this temperature sensor offers unmatched accuracy within a wide range of applications. Whether you're monitoring environmental conditions or enhancing device performance, this compact sensor delivers consistent and dependable results. Trust NXP Semiconductors to provide top-quality components that streamline your operations and elevate your products. Experience the difference with the LM75BGD today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and reliability for the temperature sensor.

Maximum Supply Voltage: 5.5 V

With a maximum supply voltage of 5.5 V, this temperature sensor can be used in a variety of applications without any power issues.

No. of Bits: 11

Having 11 bits ensures high resolution and accuracy in temperature measurement.

Body Width: 2 inch

The 2-inch body width allows for easy integration and installation of the temperature sensor.

Power Supplies (V): 3/5

Compatibility with both 3V and 5V power supplies makes this sensor versatile and suitable for different electronic systems.

Sensors or Transducers Type: TEMPERATURE SENSOR, SWITCH/DIGITAL OUTPUT, SERIAL

Support for multiple sensor types and output interfaces offers flexibility in the use of this temperature sensor.

No. of Terminals: 8

Having 8 terminals allows for easy connectivity and integration in electronic circuits.

Body Height: 0.5 mm

Low body height allows for compact design and easy installation in space-constrained applications.

Package Shape or Style: RECTANGULAR

Rectangular package shape makes it easy to mount and integrate the temperature sensor in various devices.

Minimum Supply Voltage: 2.8 V

Low minimum supply voltage ensures efficient power consumption and compatibility with a wide range of power sources.

Maximum Operating Temperature: 125 °C

High maximum operating temperature of 125°C allows this sensor to be used in high-temperature environments without risking damage.

Minimum Operating Temperature: -55 °C

Low minimum operating temperature of -55°C enables this sensor to be used in extreme cold conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel Palladium Gold terminal finish ensures good conductivity and long-term reliability in contact with other components.

Maximum Operating Current: 5 mA

Low maximum operating current of 5 mA helps in minimizing power consumption and heat dissipation.

Housing: PLASTIC

Plastic housing provides insulation and protection for the internal components of the temperature sensor.

Maximum Accuracy °C: 3

With a maximum accuracy of 3°C, this sensor provides precise temperature readings for critical applications.

Body Length/Diameter: 3 mm

Compact body length/diameter of 3 mm enables easy placement and integration of the temperature sensor in devices.

Termination Type: SOLDER

Solder termination type ensures secure and reliable connections between the temperature sensor and the circuit board.

Output Interface Type: 2-WIRE INTERFACE

2-wire interface simplifies connectivity and communication with other devices, enhancing the usability of the temperature sensor.

Mounting Feature: SURFACE MOUNT

Surface mount feature allows for easy and secure mounting of the temperature sensor on circuit boards without the need for additional hardware.

Technical Specifications

Temperature Sensors LM75BGD attributes and parameters. Explore more Temperature Sensors devices from NXP Semiconductors

Specs

Maximum Accuracy (Cel):

3

Body Width:

2 inch

Body Height:

.5 mm

Body Length/Diameter:

3 mm

Housing:

PLASTIC

JESD-609 Code:

e4

Mounting Feature:

No. of Bits:

11

No. of Terminals:

8

Maximum Operating Current:

5 mA

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Interface Type:

2-WIRE INTERFACE

Package Body Material:

PLASTIC/EPOXY

Package Equivalence Code:

SOLCC8,.12,20

Package Shape or Style:

Power Supplies (V):

3/5

Sub-Category:

Other Sensors

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.8 V

Terminal Finish:

NICKEL PALLADIUM GOLD

Termination Type:

SOLDER

Trade Compliance

LM75BGD Sensors & Transducers trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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