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LM75ADP

NXP Semiconductors

LM75ADP by NXP Semiconductors

NXP Semiconductors' LM75ADP is a digital output temperature sensor with 11-bit resolution, operating from -55 to 125°C. It features a 2-wire interface, nickel-palladium-gold finish, and ±3°C accuracy. Ideal for applications requiring precise temperature monitoring in compact spaces.

Median Price

$0.620

Lifecycle Status

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Ampacity Inc.

Singapore . 695 parts In-Stock

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Corohmni

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Overview

Discover the NXP Semiconductors LM75ADP, a top-quality temperature sensor that offers unmatched precision and reliability. With a wide operating temperature range and high accuracy, this sensor is perfect for a variety of applications. Whether you're monitoring environmental conditions or controlling heating systems, the LM75ADP delivers consistent and accurate results. Trust in NXP Semiconductors' reputation for excellence and choose the LM75ADP for all your temperature sensing needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the sensor lightweight and easy to handle.

Maximum Supply Voltage: 5.5 V

The high maximum supply voltage allows for flexibility in power supply options and compatibility with a wide range of systems.

No. of Bits: 11

The 11-bit resolution provides accurate temperature sensing, allowing for precise control and monitoring of temperature levels.

Body Width: 3 inch

The compact body width of 3 inches enables easy integration into various systems and applications.

Power Supplies (V): 2.8/5.5

The dual power supply options of 2.8V and 5.5V provide flexibility in voltage selection based on system requirements.

Sensors or Transducers Type: TEMPERATURE SENSOR, SWITCH/DIGITAL OUTPUT, SERIAL

The multiple sensor types allow for versatile temperature sensing solutions, including switch and digital output options.

No. of Terminals: 8

The 8 terminals provide secure connections for reliable data transmission and power supply.

Body Height: 1.1 mm

The low body height of 1.1 mm allows for space-efficient installation in compact devices and systems.

Package Shape or Style: SQUARE

The square package shape offers a standardized form factor for easy mounting and integration.

Minimum Supply Voltage: 2.8 V

The low minimum supply voltage of 2.8V ensures efficient power consumption and compatibility with low-power systems.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature of 125°C enables reliable performance in high-temperature environments.

Minimum Operating Temperature: -55 °C

The wide range of minimum operating temperature of -55°C allows for use in extreme cold conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold finish provides excellent conductivity and resistance to corrosion for long-lasting performance.

Maximum Operating Current: 1 mA

The low maximum operating current of 1 mA ensures minimal power consumption during operation.

Housing: PLASTIC

The plastic housing offers durability and protection for the sensor components, making it suitable for various applications.

Maximum Accuracy °C: 3

The high maximum accuracy of 3°C ensures precise temperature measurements for accurate control and monitoring.

Body Length/Diameter: 3 mm

The compact body length/diameter of 3 mm allows for easy installation in tight spaces and small devices.

Temperature Coef (ppm/°C): NEGATIVE/POSITIVE

The negative/positive temperature coefficient ensures reliable temperature compensation for accurate sensor readings.

Termination Type: SOLDER

The solder termination provides secure connections for stable data transmission and power supply.

Output Interface Type: 2-WIRE INTERFACE

The 2-wire interface simplifies the connection process and allows for easy integration with compatible systems.

Mounting Feature: SURFACE MOUNT

The surface mount feature enables easy and secure mounting on PCBs or other surfaces, simplifying the installation process.

Technical Specifications

Temperature Sensors LM75ADP attributes and parameters. Explore more Temperature Sensors devices from NXP Semiconductors

Specs

Maximum Accuracy (Cel):

3

Additional Features:

THERMAL WATCHDOG

Body Width:

3 inch

Body Height:

1.1 mm

Body Length/Diameter:

3 mm

Housing:

PLASTIC

JESD-609 Code:

e4

Mounting Feature:

No. of Bits:

11

No. of Terminals:

8

Maximum Operating Current:

1 mA

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Interface Type:

2-WIRE INTERFACE

Package Body Material:

PLASTIC/EPOXY

Package Equivalence Code:

TSSOP8,.19

Package Shape or Style:

Power Supplies (V):

2.8/5.5

Sub-Category:

Other Sensors

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.8 V

Temperature Coef (ppm/Cel):

NEGATIVE/POSITIVE

Terminal Finish:

NICKEL PALLADIUM GOLD

Termination Type:

SOLDER

Trade Compliance

LM75ADP Sensors & Transducers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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