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LM75AD

NXP Semiconductors

LM75AD by NXP Semiconductors

LM75AD by NXP Semiconductors is a temperature sensor with a max supply voltage of 5.5V and an accuracy of 3°C. It has a 2-wire interface and is commonly used in applications such as temperature monitoring and control systems.

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Overview

Discover the LM75AD, a top-notch temperature sensor from NXP Semiconductors! With its exceptional quality and advanced manufacturing techniques, NXP has created a product that exceeds expectations. This sensor is perfect for various applications, offering accurate temperature readings and digital outputs. Say goodbye to guesswork and hello to precision! Whether you need it for industrial processes or household appliances, the LM75AD guarantees reliable performance. Experience the value, benefits, and advantages it brings to your projects. Trust NXP Semiconductors and revolutionize your temperature sensing needs with the LM75AD today!

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - This material provides durability and resistance to harsh environmental conditions, making the temperature sensor suitable for various applications.

Maximum Supply Voltage:

5.5 V - The high maximum supply voltage ensures compatibility with a wide range of power sources, offering flexibility in design and operation.

No. of Bits:

11 - With 11 bits, the temperature sensor can provide precise and accurate temperature measurements, enhancing the overall reliability of the system.

Body Width:

3.9 inch - The compact body width allows for space-saving integration into tight spaces or PCB layouts, making it suitable for applications with size constraints.

Power Supplies (V):

2.8/5.5 - The wide range of power supply options ensures compatibility with different voltage levels, enabling versatile use in various electronic systems.

Sensors or Transducers Type:

TEMPERATURE SENSOR, SWITCH/DIGITAL OUTPUT, SERIAL - This product offers multiple output options, providing flexibility for different interface requirements and enabling seamless integration into existing systems.

No. of Terminals:

8 - The presence of 8 terminals allows for easy and secure connections, ensuring reliable signal transmission and minimizing the risk of connectivity issues.

Body Height:

1.75 mm - The low body height facilitates space-efficient mounting, making the temperature sensor suitable for applications where height restrictions are a concern.

Package Shape or Style:

RECTANGULAR - The rectangular package shape offers compatibility with standard industry sizing, simplifying the installation process and allowing for easy replacement or upgrade.

Minimum Supply Voltage:

2.8 V - The low minimum supply voltage ensures efficient operation in low-power applications, reducing energy consumption and extending battery life.

Maximum Operating Temperature:

125 °C - With a high maximum operating temperature, the temperature sensor can withstand elevated temperature environments, expanding its range of use.

Minimum Operating Temperature:

55 °C - The low minimum operating temperature enables reliable performance even in extremely cold conditions, making the temperature sensor suitable for a wide range of applications.

Terminal Finish:

Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag) - The use of high-quality terminal finishes enhances conductivity, prevents corrosion, and ensures long-term performance and reliability.

Maximum Operating Current:

1 mA - With a low maximum operating current, the temperature sensor consumes minimal power, making it energy-efficient and well-suited for battery-powered devices.

Housing:

PLASTIC - The use of a plastic housing provides lightweight construction, reducing the overall weight of the system, and offering cost-effective and durable protection for internal components.

Maximum Accuracy °C:

3 - This product provides high accuracy in temperature measurements with a maximum deviation of only 3°C, ensuring precise monitoring and control.

Body Length/Diameter:

4.9 mm - The compact body length/diameter allows for easy integration into small spaces while maintaining excellent performance, making it suitable for miniaturized applications.

Temperature Coef (ppm/°C):

NEGATIVE/POSITIVE - The ability to compensate for temperature changes (+/- ppm) ensures accurate readings across various temperature ranges, enhancing the sensor's reliability and precision.

Termination Type:

SOLDER - The use of solder termination simplifies the assembly process, allowing for secure and efficient connections, ensuring reliable signal transmission.

Output Interface Type:

2-WIRE INTERFACE - The 2-wire interface enables simple and straightforward communication between the temperature sensor and the host system, facilitating easy integration and data exchange.

Mounting Feature:

SURFACE MOUNT - The surface mount capability allows for convenient and secure attachment to PCBs, offering ease of installation, space-saving benefits, and excellent mechanical stability.

Technical Specifications

Temperature Sensors LM75AD attributes and parameters. Explore more Temperature Sensors devices from NXP Semiconductors

Specs

Maximum Accuracy (Cel):

3

Additional Features:

THERMAL WATCHDOG

Body Width:

3.9 inch

Body Height:

1.75 mm

Body Length/Diameter:

4.9 mm

Housing:

PLASTIC

JESD-609 Code:

e4

Mounting Feature:

No. of Bits:

11

No. of Terminals:

8

Maximum Operating Current:

1 mA

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Interface Type:

2-WIRE INTERFACE

Package Body Material:

PLASTIC/EPOXY

Package Equivalence Code:

SOP8,.25

Package Shape or Style:

Power Supplies (V):

2.8/5.5

Sub-Category:

Other Sensors

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.8 V

Temperature Coef (ppm/Cel):

NEGATIVE/POSITIVE

Terminal Finish:

Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

Termination Type:

SOLDER

Trade Compliance

LM75AD Sensors & Transducers trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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