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LH75401N0M100C0

NXP Semiconductors

LH75401N0M100C0 by NXP Semiconductors

Limited Part Number Data;

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,535 parts In-Stock

1+ parts

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1k+ parts

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10k+ parts

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4,535

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Digiode

USA . 2,486 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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2,486

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Anansix

USA . 2,134 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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2,134

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 56 parts In-Stock

1+ parts

$15.310

100+ parts

-

1k+ parts

-

10k+ parts

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56

$15.310

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One Stop Electronics

USA . 454 parts In-Stock

1+ parts

$18.100

100+ parts

-

1k+ parts

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10k+ parts

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454

$18.100

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QUARKTWIN TECHNOLOGY LTD

USA . 8,875 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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8,875

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UNI Independent Distributors

Spain . 4,126 parts In-Stock

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4,126

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Corphita

USA . 894 parts In-Stock

1+ parts

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894

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Technical Specifications

Additional Parts LH75401N0M100C0 attributes and parameters. Explore more Additional Parts devices from NXP Semiconductors

Technical Specifications

Core Processor:

ARM7®

Other Names:

LH75401N0M100
425-1861

Speed:

84MHz

Operating Temperature:

-40°C ~ 85°C (TA)

Category:

Integrated Circuits (ICs)
Embedded Microcontrollers

Program Memory Type:

ROMless

RAM Size:

32K x 8

Number of I/O:

76

Peripherals:

Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT

Mounting Type:

Surface Mount

Oscillator Type:

Internal

Standard Package:

60

Series:

BlueStreak ; LH7

Package / Case:

144-LQFP

Core Size:

32-Bit Single-Core

Packaging:

Tray

Connectivity:

CANbus, EBI/EMI, Microwire, SPI, SSI, SSP, UART/USART

Data Converters:

A/D 8x10b

Voltage - Supply (Vcc/Vdd):

1.7V ~ 3.6V

Base Product Number:

LH754

Moisture Sensitivity Level (MSL):

3 (168 Hours)

Trade Compliance

LH75401N0M100C0 Miscellaneous Components trade compliance attributes, and parameters.

ECCN

3A001A3

HTS

8542.31.0001

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Authentic purchasing experiences

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