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LD6836TD/30P,125

NXP Semiconductors

LD6836TD/30P,125 by NXP Semiconductors

LD6836TD/30P,125 from NXP Semiconductors is a CMOS voltage regulator with a fixed 3V output and a max load current of 0.3A. It operates b/w -40 °C to 125 °C, ensuring reliability in various applications. Its compact design features a gull-wing terminal for easy surface mounting.

Median Price

$0.258

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 526 parts In-Stock

1+ parts

-

100+ parts

$0.258

1k+ parts

$0.214

10k+ parts

$0.191

526

-

$0.258

$0.214

$0.191

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,418 parts In-Stock

1+ parts

$0.103

100+ parts

-

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4,418

$0.103

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Vyrian

USA . 3,558 parts In-Stock

1+ parts

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3,558

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Anansix

USA . 1,433 parts In-Stock

1+ parts

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1,433

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,969 parts In-Stock

1+ parts

$0.097

100+ parts

-

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10k+ parts

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4,969

$0.097

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Microchip USA

USA . 432 parts In-Stock

1+ parts

$0.158

100+ parts

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432

$0.158

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AZTECH Wire

Italy . 84 parts In-Stock

1+ parts

$8.420

100+ parts

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84

$8.420

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UNI Independent Distributors

Spain . 3,627 parts In-Stock

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3,627

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Overview

Experience unmatched reliability with the LD6836TD/30P,125 from NXP Semiconductors, a leader in high-quality electronic components. This compact regulator excels in performance across diverse applications, ensuring consistent power delivery even in challenging environments. With a robust design and exceptional efficiency, it provides peace of mind to engineers and designers alike, driving innovation while enhancing product longevity. Elevate your projects with NXP’s trusted technology today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and reliability, making this product suitable for a variety of applications.

Surface Mount: YES

Surface mount design allows for high-density circuit board layouts and efficient use of space.

Operating Temperature (TJ-Max): 125 °C

With a maximum operating temperature of 125 °C, this regulator can function effectively in high-temperature environments.

Technology: CMOS

CMOS technology provides low power consumption and high efficiency, which is ideal for battery-operated devices.

Package Shape: RECTANGULAR

The rectangular shape provides consistent performance while simplifying the integration into varying circuit designs.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and ensure reliable connections, improving manufacturing efficiency.

Operating Temperature (TJ-Min): -40 °C

A minimum operating temperature of -40 °C allows the product to function in extreme cold conditions, increasing versatility.

Packing Method: TR

Tape and reel packing method enhances automatic assembly line processes, improving production speeds.

Maximum Voltage Tolerance: 3 %

A maximum voltage tolerance of 3% provides stable performance, ensuring consistent output under varying conditions.

Nominal Output Voltage-1: 3 V

A standard output voltage of 3V is widely compatible with many electronic components, facilitating easy integration.

No. of Terminals: 5

Five terminals allow for flexible circuit design and improved connectivity options in various applications.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE

The small outline, thin profile design is perfect for compact devices where space is a constraint.

Adjustability: FIXED

Fixed adjustability simplifies design choices and ensures a stable operational output without requiring additional calibration.

Terminal Pitch: 0.95 mm

A terminal pitch of 0.95 mm allows for high-density arrangements while maintaining ease of soldering.

Maximum Line Regulation: 0.0069 %

Exceptional line regulation ensures minimal output voltage variation despite changes in input voltage, enhancing stability.

Terminal Position: DUAL

Dual terminal position improves the layout flexibility when designing PCBs, making this regulator adaptable to different configurations.

Maximum Load Regulation: 0.0897 %

Excellent load regulation capability ensures consistent performance under varying load conditions, promoting reliability.

Maximum Output Current-1: 0.3 A

Supporting output currents of 0.3 A makes this regulator suitable for a wide range of low-power applications.

Nominal Dropout Voltage-1: 0.1 V

A low dropout voltage of 0.1 V ensures efficient operation even with minimal headroom, optimizing power usage.

Maximum Input Voltage Absolute: 6 V

A maximum input voltage of 6 V allows for compatibility with various power supply sources without exceeding safety limits.

Technical Specifications

Other Function Regulators LD6836TD/30P,125 attributes and parameters. Explore more Other Function Regulators devices from NXP Semiconductors

Specs

Adjustability:

FIXED

Nominal Dropout Voltage-1:

.1 V

Maximum Input Voltage Absolute:

6 V

JESD-30 Code:

R-PDSO-G5

Maximum Line Regulation:

.0069 %

Maximum Load Regulation:

.0897 %

No. of Outputs:

1

No. of Terminals:

5

Operating Temperature (TJ-Max):

125 Cel

Operating Temperature (TJ-Min):

-40 Cel

Maximum Output Current-1:

.3 A

Nominal Output Voltage-1:

3 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP5/6,.11,37

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE

Packing Method:

TR

Qualification Status:

Not Qualified

Sub-Category:

Other Regulators

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Maximum Voltage Tolerance:

3 %

Trade Compliance

LD6836TD/30P,125 Regulators trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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