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LD6836TD/12P,125

NXP Semiconductors

LD6836TD/12P,125 by NXP Semiconductors

LD6836TD/12P,125 from NXP Semiconductors is a CMOS voltage regulator with a fixed output of 1.2V and a max current of 0.3A. It operates b/w -40 °C to 125 °C, ensuring reliability in various environments. Ideal for compact applications due to its small outline package design.

Median Price

$0.258

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 6,670 parts In-Stock

1+ parts

-

100+ parts

$0.258

1k+ parts

$0.214

10k+ parts

$0.191

6,670

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$0.258

$0.214

$0.191

DigiKey

USA . 6,670 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

$0.380

10k+ parts

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6,670

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$0.380

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Verical

USA . 6,670 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

$0.238

6,670

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-

$0.238

Distributors (In-Stock)

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Digiode

USA . 4,577 parts In-Stock

1+ parts

$0.103

100+ parts

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4,577

$0.103

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Anansix

USA . 2,670 parts In-Stock

1+ parts

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2,670

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Vyrian

USA . 2,222 parts In-Stock

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2,222

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Distributors (Availability)

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Corphita

USA . 4,917 parts In-Stock

1+ parts

$0.097

100+ parts

-

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4,917

$0.097

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Microchip USA

USA . 419 parts In-Stock

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$0.313

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419

$0.313

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AZTECH Wire

Italy . 1,191 parts In-Stock

1+ parts

$14.650

100+ parts

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1,191

$14.650

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UNI Independent Distributors

Spain . 7,200 parts In-Stock

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7,200

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Continental Prestige Electronics

USA . 6,670 parts In-Stock

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$0.130

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6,670

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$0.130

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Overview

Elevate your designs with the LD6836TD/12P,125 from NXP Semiconductors, a leader in innovative solutions. This compact and efficient regulator ensures an ultra-stable 1.2V output even in extreme conditions, making it ideal for a variety of applications from consumer electronics to automotive systems. With NXP's commitment to quality and reliability, this component not only enhances performance but also provides peace of mind, driving your projects to success.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and resistance to environmental factors, making it suitable for a wide range of applications.

Surface Mount: YES

Surface mount capability allows for compact designs and efficient use of PCB space, which is ideal for modern electronic devices.

Operating Temperature (TJ-Max): 125 °C

A maximum operating temperature of 125 °C indicates reliability and stability under high-temperature conditions, enhancing longevity in demanding environments.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, ensuring efficient operation and integration with other components.

Package Shape: RECTANGULAR

The rectangular shape facilitates easy mounting on PCB, contributing to design flexibility and ease of handling.

Terminal Form: GULL WING

Gull wing terminals provide excellent mechanical strength and flexibility for soldering, ensuring robust connections.

Operating Temperature (TJ-Min): -40 °C

A minimum operating temperature of -40 °C makes this product suitable for extreme environments, ensuring functionality in harsh conditions.

Maximum Voltage Tolerance: 4 %

A tolerance of 4% on maximum voltage ensures that the product operates reliably within a specified range, reducing the risk of failure.

Nominal Output Voltage-1: 1.2 V

The 1.2 V output is ideal for low-voltage applications, making it suitable for powering modern electronic devices efficiently.

No. of Terminals: 5

With 5 terminals, this product offers enough connectivity options for various applications, enhancing its versatility.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE

The small outline and thin profile contribute to space efficiency on PCBs, accommodating compact designs without sacrificing performance.

Adjustability: FIXED

Fixed adjustability ensures consistent performance by eliminating variability, providing reliable output for critical applications.

Terminal Pitch: 0.95 mm

A terminal pitch of 0.95 mm allows for dense mounting options, making it suitable for advanced, miniaturized circuit designs.

Maximum Line Regulation: 0.00492 %

Exceptional line regulation ensures minimal voltage variation with changes in input voltage, enhancing the stability of output voltage.

Terminal Position: DUAL

Dual terminal positioning allows for flexible layout options on the PCB, accommodating diverse design needs.

Maximum Output Current-1: 0.3 A

A maximum output current of 0.3 A provides ample power for many low to medium power applications, making it a versatile choice.

Nominal Dropout Voltage-1: 0.1 V

The low dropout voltage ensures high efficiency and minimal power loss, which is critical for battery-powered devices.

Maximum Input Voltage Absolute: 6 V

A maximum input voltage of 6 V provides a safe operating range, ensuring compatibility with a variety of power supply systems.

Technical Specifications

Other Function Regulators LD6836TD/12P,125 attributes and parameters. Explore more Other Function Regulators devices from NXP Semiconductors

Specs

Adjustability:

FIXED

Nominal Dropout Voltage-1:

.1 V

Maximum Input Voltage Absolute:

6 V

JESD-30 Code:

R-PDSO-G5

Maximum Line Regulation:

.00492 %

No. of Outputs:

1

No. of Terminals:

5

Operating Temperature (TJ-Max):

125 Cel

Operating Temperature (TJ-Min):

-40 Cel

Maximum Output Current-1:

.3 A

Nominal Output Voltage-1:

1.2 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP5/6,.11,37

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE

Qualification Status:

Not Qualified

Sub-Category:

Other Regulators

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Maximum Voltage Tolerance:

4 %

Trade Compliance

LD6836TD/12P,125 Regulators trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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