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KMZ10B,112

NXP Semiconductors

KMZ10B,112 by NXP Semiconductors

MAGNETIC FIELD SENSOR,MAGNETORESISTIVE; Mounting Feature: THROUGH HOLE MOUNT; No. of Terminals: 4; Output Type: DIGITAL VOLTAGE; Package Shape or Style: RECTANGULAR; Body Height: 5.1 mm;

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,554 parts In-Stock

1+ parts

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8,554

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Anansix

USA . 1,816 parts In-Stock

1+ parts

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1,816

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Digiode

USA . 984 parts In-Stock

1+ parts

-

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984

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 440 parts In-Stock

1+ parts

$5.750

100+ parts

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1k+ parts

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440

$5.750

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AZTECH Wire

Italy . 1,059 parts In-Stock

1+ parts

$13.780

100+ parts

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1,059

$13.780

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Component Stockers USA

USA . 302 parts In-Stock

1+ parts

$99.990

100+ parts

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302

$99.990

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UNI Independent Distributors

Spain . 7,015 parts In-Stock

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7,015

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Corphita

USA . 4,712 parts In-Stock

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4,712

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Technical Specifications

Magnetic Field Sensors KMZ10B,112 attributes and parameters. Explore more Magnetic Field Sensors devices from NXP Semiconductors

Specs

Body Width:

1.7 inch

Body Height:

5.1 mm

Body Length/Diameter:

4.6 mm

Housing:

PLASTIC

Hysteresis:

.5 mT

JESD-609 Code:

e3

Maximum Magnetic Field Range:

1.25 mT

Minimum Range Of Magnetic Field:

-1.25 mT

Mounting Feature:

No. of Axes:

1

No. of Terminals:

4

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-40 Cel

Output (V):

BRIDGE

Output Type:

Package Body Material:

PLASTIC/EPOXY

Package Equivalence Code:

SIP4,.04,50

Package Shape or Style:

Power Supplies (V):

5

Resistance:

2600 ohm

Sensitivity (mV/G):

4.8 mV/G

Sensors or Transducers Type:

Sub-Category:

Other Sensors

Maximum Supply Voltage:

10 V

Terminal Finish:

Matte Tin (Sn)

Termination Type:

SOLDER

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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