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KMA321/A

NXP Semiconductors

KMA321/A by NXP Semiconductors

ANGLE SENSOR; Mounting Feature: THROUGH HOLE MOUNT; No. of Terminals: 4; Output Type: DIGITAL OUTPUT; Package Shape or Style: RECTANGULAR; Output Range: 0.5-4.1V;

Median Price

-

Lifecycle Status

EOL

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,850 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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5,850

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-

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Digiode

USA . 3,603 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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3,603

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Flip Electronics

USA . 1,150 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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1,150

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-

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Anansix

USA . 318 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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318

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Cogito LLC

Ukraine . 5 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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5

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 678 parts In-Stock

1+ parts

$16.850

100+ parts

-

1k+ parts

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10k+ parts

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678

$16.850

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One Stop Electronics

USA . 650 parts In-Stock

1+ parts

$48.750

100+ parts

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650

$48.750

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UNI Independent Distributors

Spain . 5,445 parts In-Stock

1+ parts

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5,445

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Corphita

USA . 3,215 parts In-Stock

1+ parts

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3,215

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Technical Specifications

Other Function Sensors & Transducers KMA321/A attributes and parameters. Explore more Other Function Sensors & Transducers devices from NXP Semiconductors

Specs

Body Width:

7.8 inch

Body Height:

1.95 mm

Body Length/Diameter:

11 mm

Mounting Feature:

No. of Terminals:

4

Maximum Operating Temperature:

180 Cel

Minimum Operating Temperature:

-40 Cel

Output (V):

DIGITAL

Output Range:

Output Type:

Package Body Material:

PLASTIC/EPOXY

Package Equivalence Code:

SIP4,.04,70

Package Shape or Style:

Screening Level:

AEC-Q100; ISO 26262

Sensors or Transducers Type:

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

Authentic purchasing experiences

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