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KMA200T/R

NXP Semiconductors

KMA200T/R by NXP Semiconductors

KMA200T/R by NXP Semiconductors is a hybrid sensor designed for extreme conditions, operating b/w -40 °C and 160 °C. It features a plastic/epoxy package and requires a 5V power supply, providing output via a bridge configuration. Ideal for various industrial applications, it ensures reliable performance in harsh environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,667 parts In-Stock

1+ parts

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2,667

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Anansix

USA . 2,234 parts In-Stock

1+ parts

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1k+ parts

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2,234

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Vyrian

USA . 121 parts In-Stock

1+ parts

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121

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,519 parts In-Stock

1+ parts

$45.750

100+ parts

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1k+ parts

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10k+ parts

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1,519

$45.750

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UNI Independent Distributors

Spain . 4,830 parts In-Stock

1+ parts

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4,830

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Corphita

USA . 2,148 parts In-Stock

1+ parts

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2,148

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Overview

Elevate your projects with the KMA200T/R from NXP Semiconductors, a trusted leader in innovation. This hybrid sensor seamlessly operates across extreme temperatures, ensuring reliability in diverse applications—from automotive to industrial systems. Its robust plastic/epoxy design guarantees durability, while the precise output enhances performance. Experience unmatched quality and precision that empowers you to create smarter, more efficient solutions. Choose KMA200T/R for unparalleled value in every application!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material provides durability and resistance to environmental factors, making this sensor suitable for a wide range of applications.

Power Supplies (V): 5

Operating with a low power supply requirement of 5V enhances energy efficiency, making this product ideal for battery-powered or energy-sensitive applications.

Maximum Operating Temperature: 160 °C

With a maximum operating temperature of 160 °C, this product is engineered to withstand high-heat environments without compromising performance, suitable for industrial applications.

Minimum Operating Temperature: -40 °C

A minimum operating temperature of -40 °C allows this sensor to function effectively in extreme cold environments, increasing its versatility across various climates.

Output (V): BRIDGE

The bridge output configuration enables precise measurements and improved linearity, ensuring accurate data acquisition in various sensing applications.

Technology: HYBRID

The hybrid technology combines the advantages of various sensing methods, providing enhanced performance, reliability, and flexibility in diverse use cases.

Technical Specifications

Other Function Sensors & Transducers KMA200T/R attributes and parameters. Explore more Other Function Sensors & Transducers devices from NXP Semiconductors

Specs

No. of Axes:

1

Maximum Operating Temperature:

160 Cel

Minimum Operating Temperature:

-40 Cel

Output (V):

BRIDGE

Package Body Material:

PLASTIC/EPOXY

Package Equivalence Code:

SOT-637

Power Supplies (V):

5

Sub-Category:

Other Sensors

Technology:

HYBRID

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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