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HEF4059BP,652

NXP Semiconductors

HEF4059BP,652 by NXP Semiconductors

DIVIDE BY N COUNTER; Temperature Grade: INDUSTRIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 24; Package Code: DIP; Package Shape: RECTANGULAR;

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,285 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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3,285

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Vyrian

USA . 2,234 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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2,234

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Anansix

USA . 574 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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574

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Northwest PG Solutions

USA . 1,289 parts In-Stock

1+ parts

$2.802

100+ parts

-

1k+ parts

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10k+ parts

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1,289

$2.802

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One Stop Electronics

USA . 772 parts In-Stock

1+ parts

$5.000

100+ parts

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10k+ parts

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772

$5.000

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Microchip USA

USA . 500 parts In-Stock

1+ parts

$8.320

100+ parts

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1k+ parts

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500

$8.320

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AZTECH Wire

Italy . 1,128 parts In-Stock

1+ parts

$16.710

100+ parts

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1k+ parts

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1,128

$16.710

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UNI Independent Distributors

Spain . 7,017 parts In-Stock

1+ parts

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7,017

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Corphita

USA . 3,299 parts In-Stock

1+ parts

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3,299

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Perfect Parts

USA . 261 parts In-Stock

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261

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Native Components

USA . 84 parts In-Stock

1+ parts

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100+ parts

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$2.471

10k+ parts

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84

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$2.471

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Technical Specifications

Digital Counters HEF4059BP,652 attributes and parameters. Explore more Digital Counters devices from NXP Semiconductors

Specs

Additional Features:

PROGRAMMABLE TO DIVIDE INPUT BY 3-15999; 10 MODES OF OPERATION; SCHMITT TRIGGER ON CLOCK INPUT

Count Direction:

DOWN

Family:

4000/14000/40000

JESD-30 Code:

R-PDIP-T24

JESD-609 Code:

e3

Length:

31.7 mm

Load or Preset Input:

YES

Logic IC Type:

Maximum Frequency At Nominal Supply:

3500000 Hz

Operation Mode:

ASYNCHRONOUS

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP24,.6

Package Shape:

Package Style (Meter):

IN-LINE

Propagation Delay (tpd):

180 ns

Qualification:

Not Qualified

Maximum Seated Height:

5.1 mm

Sub-Category:

Prescaler/Multivibrators

Maximum Supply Voltage (Vsup):

15 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trigger Type:

POSITIVE EDGE

Width:

15.24 mm

Minimum fmax:

20 MHz

Trade Compliance

HEF4059BP,652 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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