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H1622-002

NXP Semiconductors

H1622-002 by NXP Semiconductors

PROXIMITY SENSOR,HALL EFFECT; Output Type: ANALOG CURRENT; Package Shape or Style: ROUND; Minimum Measurement Range (mm): .12 mm; Housing: STAINLESS STEEL; Additional Features: TTL COMPATIBLE;

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,028 parts In-Stock

1+ parts

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4,028

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Vyrian

USA . 2,698 parts In-Stock

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2,698

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Anansix

USA . 1,825 parts In-Stock

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1,825

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 895 parts In-Stock

1+ parts

$1.019

100+ parts

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895

$1.019

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Northwest PG Solutions

USA . 1,119 parts In-Stock

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$1.121

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1,119

$1.121

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One Stop Electronics

USA . 891 parts In-Stock

1+ parts

$40.750

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891

$40.750

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UNI Independent Distributors

Spain . 3,076 parts In-Stock

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3,076

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Corphita

USA . 222 parts In-Stock

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222

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Technical Specifications

Proximity Sensors H1622-002 attributes and parameters. Explore more Proximity Sensors devices from NXP Semiconductors

Specs

Additional Features:

TTL COMPATIBLE

Body Height:

5.26 mm

Body Length/Diameter:

1 mm

Housing:

STAINLESS STEEL

Maximum Measurement Range (mm):

1.52 mm

Minimum Measurement Range (mm):

.12 mm

Maximum Operating Current:

50 mA

Output Type:

Package Shape or Style:

Sensors or Transducers Type:

Termination Type:

CABLE

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

Authentic purchasing experiences

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