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DAC1205D650HW/C1,5

NXP Semiconductors

DAC1205D650HW/C1,5 by NXP Semiconductors

DAC1205D650HW/C1,5 by NXP Semiconductors is a 12-bit D/A converter designed for industrial applications. It features a quad terminal layout with a flatpack style and operates within -40 °C to 85 °C. This surface-mount device supports dual functions and requires power supplies of 1.8V or 3.3V.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,620 parts In-Stock

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Digiode

USA . 3,803 parts In-Stock

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Anansix

USA . 1,914 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 10 parts In-Stock

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10

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One Stop Electronics

USA . 1,161 parts In-Stock

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$1.000

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AZTECH Wire

Italy . 630 parts In-Stock

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$19.000

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630

$19.000

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Advanced Electronics

New Zealand . 5,000 parts In-Stock

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$23.875

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$21.726

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$19.578

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$23.875

$21.726

$19.578

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Component Stockers USA

USA . 393 parts In-Stock

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$99.990

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UNI Independent Distributors

Spain . 5,623 parts In-Stock

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Microchip USA

USA . 3,738 parts In-Stock

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Northwest PG Solutions

USA . 2,239 parts In-Stock

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Vigor

Singapore . 1,850 parts In-Stock

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Corphita

USA . 883 parts In-Stock

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Native Components

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Perfect Parts

USA . 22 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 10 parts In-Stock

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Overview

Unlock precision and reliability with the DAC1205D650HW/C1,5 from NXP Semiconductors, a leader in innovative technology. This dual-function D/A converter is designed for robust performance across various industrial applications, ensuring seamless integration and superior signal quality. With its wide operating temperature range and compact design, it’s perfect for demanding environments, delivering exceptional value and efficiency to elevate your projects. Choose NXP for quality that drives success!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy materials ensures durability and resistance to environmental factors, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for a smaller footprint on the circuit board, enabling compact designs.

No. of Functions: 2

With two functions, this device provides versatile performance, capable of meeting diverse application requirements.

Package Shape: SQUARE

The square package shape facilitates efficient use of space on printed circuit boards (PCBs), enhancing design flexibility.

No. of Bits: 12

A 12-bit resolution allows for high precision in analog output, making it ideal for applications requiring fine control.

Power Supplies (V): 1.8, 3.3

Support for dual voltage levels enhances compatibility with different systems and reduces power consumption, improving energy efficiency.

No. of Terminals: 100

A higher number of terminals increases connectivity options, facilitating integration into complex systems.

Package Style (Meter): FLATPACK

The flatpack style aids in thermal dissipation and minimizes height, making it an excellent choice for tight spaces.

Maximum Operating Temperature: 85 ºC

An operational range up to 85 ºC ensures stable performance in high-temperature environments, making it suitable for industrial applications.

Minimum Operating Temperature: -40 ºC

The wide temperature range (-40 to 85 ºC) ensures reliable functionality in extreme conditions, ideal for outdoor and critical applications.

Terminal Position: QUAD

Quad terminal positioning enhances signal integrity and improves layout options for efficient routing on PCBs.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, this product guarantees robustness and reliability in demanding environments.

Terminal Form: GULL WING

Gull wing terminals provide excellent soldering characteristics and mechanical stability, ensuring lasting connections.

Converter Type: D/A CONVERTER

As a digital-to-analog converter, this product effectively bridges digital systems and analog signal requirements, essential for many applications.

Terminal Pitch: 0.5 mm

A small terminal pitch supports high-density designs, maximizing the number of connections in limited space.

Input Bit Code: OFFSET BINARY, 2'S COMPLEMENT BINARY

Support for multiple input bit codes increases flexibility and integration options with various digital systems, enhancing application compatibility.

Technical Specifications

Other Function Converters DAC1205D650HW/C1,5 attributes and parameters. Explore more Other Function Converters devices from NXP Semiconductors

Converter Specifications

Converter Type:

No. of Bits:

12

No. of Functions:

2

Input Bit Code:

Offset Binary, 2's Complement Binary

Operating Conditions

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Form Factor

No. of Terminals:

100

Terminal Form:

Terminal Position:

Quad

Terminal Pitch:

0.02 in (0.5 mm)

Surface Mount:

Yes

Packaging

Package Shape:

Package Body Material:

Plastic/Epoxy

Package Code:

QFP

Package Style:

Flatpack

Package Equivalence Code:

TQFP100,.63SQ

Standards and Codes

Qualified:

No

JESD-30 Code:

S-PQFP-G100

Trade Compliance

DAC1205D650HW/C1,5 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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