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DAC1201D125HL/C1,1

NXP Semiconductors

DAC1201D125HL/C1,1 by NXP Semiconductors

DAC1201D125HL/C1,1 from NXP Semiconductors is a 12-bit D/A converter designed for industrial applications. It features a max linearity error of just 0.017% and operates within -40 °C to 85 °C, making it ideal for demanding environments. With a compact flatpack design and surface mount capability, it ensures efficient integration in various electronic systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

USA . 8,613 parts In-Stock

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Digiode

USA . 4,939 parts In-Stock

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Anansix

USA . 208 parts In-Stock

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AZTECH Wire

Italy . 418 parts In-Stock

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$8.820

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One Stop Electronics

USA . 1,285 parts In-Stock

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$12.000

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Component Stockers USA

USA . 510 parts In-Stock

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$99.990

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510

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QUARKTWIN TECHNOLOGY LTD

USA . 29,165 parts In-Stock

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Corphita

USA . 4,515 parts In-Stock

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Microchip USA

USA . 4,230 parts In-Stock

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UNI Independent Distributors

Spain . 1,243 parts In-Stock

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Vigor

Singapore . 1,217 parts In-Stock

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Native Components

USA . 970 parts In-Stock

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Northwest PG Solutions

USA . 400 parts In-Stock

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Overview

Elevate your projects with the DAC1201D125HL/C1,1 from NXP Semiconductors—where cutting-edge technology meets unparalleled reliability. This high-performance 12-bit D/A converter is designed for industrial applications, ensuring exceptional accuracy and stability in demanding environments. With its compact surface mount design and robust temperature range, it seamlessly integrates into your systems, delivering superior functionality while maximizing efficiency. Trust NXP's legacy of innovation to enhance your designs today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and protection against environmental factors, making the product reliable for various applications.

Surface Mount: YES

Surface mount technology allows for compact design and efficient use of circuit board space, enhancing the overall integration of the product.

No. of Functions: 2

With two functional capabilities, this product offers versatility, making it suitable for a range of applications.

Package Shape: SQUARE

The square package shape optimizes layout efficiency, allowing for easier integration into existing PCB designs.

No. of Bits: 12

A 12-bit resolution provides high precision in data conversion, enhancing the performance of your application.

Maximum Linearity Error (EL): 0.017%

A low linearity error ensures accurate and consistent performance, critical for high-quality signal processing.

Power Supplies (V): 3.3

Operating at a common voltage level of 3.3V makes it compatible with most modern digital systems, increasing its usability.

No. of Terminals: 48

With 48 terminals, this product facilitates complex connectivity options, enabling extensive functionality within a compact footprint.

Package Style (Meter): FLATPACK

Flatpack design allows for efficient thermal dissipation and aids in maintaining consistent performance across temperature ranges.

Maximum Operating Temperature: 85 °C

The ability to operate at high temperatures ensures reliability in demanding environments, increasing the product's versatility.

Minimum Operating Temperature: -40 °C

With a wide operational temperature range, this product is suitable for industrial applications, even in harsh conditions.

Terminal Position: QUAD

Quad terminal position allows for easier soldering and enhances device stability on the PCB.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, this temperature grade guarantees performance and reliability in varied conditions.

Technology: CMOS

CMOS technology enables low power consumption and high-speed operation, making it an eco-friendly and efficient choice.

Terminal Form: GULL WING

Gull wing terminals provide robust mechanical support and ease of handling during assembly, ensuring better connectivity.

Maximum Supply Current: 65 mA

A moderate current draw keeps power requirements manageable, promoting energy efficiency in your design.

Converter Type: D/A CONVERTER

As a D/A converter, this product excels in converting digital signals to analog, making it ideal for audio and video applications.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage of 3.3V aligns with current electronic standards, ensuring compatibility with most devices.

Terminal Pitch: 0.5 mm

The 0.5 mm terminal pitch allows for high-density layouts, crucial for compact circuit designs.

Input Bit Code: BINARY

The binary input bit code standardizes input methods, making it easy to interface with digital systems.

Technical Specifications

Other Function Converters DAC1201D125HL/C1,1 attributes and parameters. Explore more Other Function Converters devices from NXP Semiconductors

Converter Specifications

Converter Type:

Technology:

CMOS

No. of Bits:

12

No. of Functions:

2

Input Bit Code:

Binary

Maximum Linearity Error (EL):

0.017 %

Electrical Specifications

Maximum Supply Current:

65 mA

Nominal Supply Voltage:

3.3 V

Operating Conditions

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Form Factor

No. of Terminals:

48

Terminal Form:

Terminal Position:

Quad

Terminal Pitch:

0.02 in (0.5 mm)

Surface Mount:

Yes

Packaging

Package Shape:

Package Body Material:

Plastic/Epoxy

Package Code:

QFP

Package Style:

Flatpack

Package Equivalence Code:

QFP48,.35SQ,20

Standards and Codes

Qualified:

No

JESD-30 Code:

S-PQFP-G48

Trade Compliance

DAC1201D125HL/C1,1 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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