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BZA956AVL,115

NXP Semiconductors

BZA956AVL,115 by NXP Semiconductors

TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 5; Surface Mount: YES; Package Shape: RECTANGULAR;

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,310 parts In-Stock

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6,310

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Anansix

USA . 2,436 parts In-Stock

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2,436

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Digiode

USA . 569 parts In-Stock

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569

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ACDS - Activité Composants Distribution Service

France . 400 parts In-Stock

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400

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Distributors (Availability)

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Native Components

USA . 651 parts In-Stock

1+ parts

$0.162

100+ parts

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$0.155

651

$0.162

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$0.155

Northwest PG Solutions

USA . 2,328 parts In-Stock

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$0.178

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$0.157

2,328

$0.178

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$0.157

One Stop Electronics

USA . 583 parts In-Stock

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$2.010

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583

$2.010

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AZTECH Wire

Italy . 543 parts In-Stock

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$18.570

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543

$18.570

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Component Stockers USA

USA . 694 parts In-Stock

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$99.990

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694

$99.990

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Corphita

USA . 4,053 parts In-Stock

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4,053

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Perfect Parts

USA . 1,966 parts In-Stock

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A-Z Elektronik GmbH

Germany . 1,190 parts In-Stock

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UNI Independent Distributors

Spain . 847 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 400 parts In-Stock

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400

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Technical Specifications

Transient Suppression Devices BZA956AVL,115 attributes and parameters. Explore more Transient Suppression Devices devices from NXP Semiconductors

Specs

Nominal Breakdown Voltage:

5.6 V

Config:

COMMON ANODE, 4 ELEMENTS

Diode Element Material:

SILICON

JESD-30 Code:

R-PDSO-F5

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

Maximum Non Repetitive Peak Reverse Power Dissipation:

6 W

No. of Elements:

4

No. of Terminals:

5

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity:

UNIDIRECTIONAL

Maximum Power Dissipation:

.335 W

Qualification:

Not Qualified

Sub-Category:

Transient Suppressors

Surface Mount:

YES

Technology:

AVALANCHE

Terminal Finish:

TIN

Terminal Form:

Terminal Position:

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

BZA956AVL,115 Diodes trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.10.00.50

SB

8541.10.00.50

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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