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BUK96150-55A,118

NXP Semiconductors

BUK96150-55A,118 by NXP Semiconductors

Limited Part Number Data;

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,260 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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8,260

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-

-

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Anansix

USA . 2,228 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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2,228

-

-

-

-

Digiode

USA . 981 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

981

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 724 parts In-Stock

1+ parts

$20.650

100+ parts

-

1k+ parts

-

10k+ parts

-

724

$20.650

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-

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One Stop Electronics

USA . 338 parts In-Stock

1+ parts

$198.100

100+ parts

-

1k+ parts

-

10k+ parts

-

338

$198.100

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-

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UNI Independent Distributors

Spain . 6,150 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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6,150

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-

-

-

Corphita

USA . 1,551 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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1,551

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Northwest PG Solutions

USA . 464 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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464

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Microchip USA

USA . 461 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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461

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Native Components

USA . 334 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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334

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Technical Specifications

Additional Parts BUK96150-55A,118 attributes and parameters. Explore more Additional Parts devices from NXP Semiconductors

Technical Specifications

Other Names:

BUK96150-55A /T3-ND
BUK96150-55A /T3
934056271118

Operating Temperature:

-55°C ~ 175°C (TJ)

Category:

Discrete Semiconductor Products
Transistors FETs, MOSFETs Single FETs, MOSFETs

FET Type:

N-Channel

Input Capacitance (Ciss) (Max) @ Vds:

339 pF @ 25 V

Mounting Type:

Surface Mount

Rds On (Max) @ Id, Vgs:

137mOhm @ 13A, 10V

Vgs(th) (Max) @ Id:

2V @ 1mA

Supplier Device Package:

D2PAK

Standard Package:

50

Drain to Source Voltage (Vdss):

55 V

Series:

TrenchMOS™

Power Dissipation (Max):

53W (Tc)

Package / Case:

TO-263-3, D2PAK (2 Leads + Tab), TO-263AB

Technology:

MOSFET (Metal Oxide)

Packaging:

Tape & Reel (TR)

Current - Continuous Drain (Id) @ 25°C:

13A (Tc)

Vgs (Max):

±10V

Drive Voltage (Max Rds On, Min Rds On):

4.5V, 10V

Base Product Number:

BUK96

Moisture Sensitivity Level (MSL):

1 (Unlimited)

Trade Compliance

BUK96150-55A,118 Miscellaneous Components trade compliance attributes, and parameters.

ECCN

EAR99

HTS

8541.29.0095

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Authentic purchasing experiences

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