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BRS212-280

NXP Semiconductors

BRS212-280 by NXP Semiconductors

SYMMETRICAL BOD; Package Style (Meter): SMALL OUTLINE; Surface Mount: YES; Terminal Position: DUAL; Configuration: SINGLE; Nominal Holding Current: 150 mA;

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

ACDS - Activité Composants Distribution Service

France . 6,000 parts In-Stock

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6,000

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Digiode

USA . 2,857 parts In-Stock

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2,857

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Anansix

USA . 2,008 parts In-Stock

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2,008

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Vyrian

USA . 384 parts In-Stock

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384

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 389 parts In-Stock

1+ parts

$0.507

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389

$0.507

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Northwest PG Solutions

USA . 1,530 parts In-Stock

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$0.557

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$0.491

1,530

$0.557

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$0.491

One Stop Electronics

USA . 215 parts In-Stock

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$3.100

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215

$3.100

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Perfect Parts

USA . 13,440 parts In-Stock

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13,440

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UNI Independent Distributors

Spain . 6,597 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 6,000 parts In-Stock

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6,000

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Glotronic Ltd.

UK . 4,800 parts In-Stock

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4,800

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Corphita

USA . 816 parts In-Stock

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816

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Technical Specifications

Breakover Diodes BRS212-280 attributes and parameters. Explore more Breakover Diodes devices from NXP Semiconductors

Specs

Maximum Breakdown Voltage:

314 V

Configuration:

Nominal Holding Current:

150 mA

JESD-30 Code:

R-PDSO-C2

Maximum Non Repetitive Peak Forward Current:

15 A

No. of Elements:

1

No. of Terminals:

2

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Form:

C BEND

Terminal Position:

Trigger Device Type:

Trade Compliance

BRS212-280 Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.30.00.80

SB

8541.30.00.80

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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