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BGO807,112

NXP Semiconductors

BGO807,112 by NXP Semiconductors

RECEIVER; Mounting Feature: THROUGH HOLE MOUNT; Maximum Supply Voltage: 24 V; Terminal Finish: Gold (Au); Maximum Operating Temperature: 85 Cel; Minimum Operating Temperature: -20 Cel;

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,136 parts In-Stock

1+ parts

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3,136

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Digiode

USA . 2,589 parts In-Stock

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2,589

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Anansix

USA . 306 parts In-Stock

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306

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 177 parts In-Stock

1+ parts

$590.000

100+ parts

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177

$590.000

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Native Components

USA . 546 parts In-Stock

1+ parts

$708.340

100+ parts

$694.173

1k+ parts

$687.090

10k+ parts

$680.006

546

$708.340

$694.173

$687.090

$680.006

Northwest PG Solutions

USA . 2,154 parts In-Stock

1+ parts

$779.174

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2,154

$779.174

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Microchip USA

USA . 4,751 parts In-Stock

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4,751

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UNI Independent Distributors

Spain . 3,283 parts In-Stock

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3,283

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Corphita

USA . 2,093 parts In-Stock

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2,093

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Technical Specifications

Fiber Optics - Receivers BGO807,112 attributes and parameters. Explore more Fiber Optics - Receivers devices from NXP Semiconductors

Specs

Additional Features:

IT ALSO AS SC/APC CONNECTOR

Body Height:

9.1 mm

Built-in Features:

AMPLIFIER

Connection Type:

FC/APC CONNECTOR

Emitter or Detector Type:

PIN PHOTODIODE

Fiber Optic Type:

JESD-609 Code:

e4

Mounting Feature:

Maximum Operating Temperature:

Minimum Operating Temperature:

Maximum Operating Wavelength:

1600 nm

Minimum Operating Wavelength:

1290 nm

Nominal Operating Wavelength:

1445 nm

Reception Type:

DIGITAL

Minimum Return Loss:

11 dB

Sub-Category:

Fiber Optic Receivers

Maximum Supply Voltage:

Terminal Finish:

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

Authentic purchasing experiences

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