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AU5790D

NXP Semiconductors

AU5790D by NXP Semiconductors

AU5790D by NXP Semiconductors is a BICMOS technology network interface with 8 terminals, operating at 12V. It has a data rate of 0.1 Mbps and is designed for automotive applications due to its temperature grade of -40 to 125°C. The package style is small outline, making it suitable for surface mount applications in compact spaces.

Median Price

$6.150

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Component Electronics Inc.

Canada . 21 parts In-Stock

1+ parts

$6.150

100+ parts

$4.620

1k+ parts

$4.000

10k+ parts

-

21

$6.150

$4.620

$4.000

-

Chip Stock

USA . 37,800 parts In-Stock

1+ parts

-

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37,800

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VNN

France . 28,093 parts In-Stock

1+ parts

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28,093

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-

-

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ComSIT Distribution GmbH

Germany . 12,500 parts In-Stock

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12,500

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-

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ComSIT USA

USA . 12,500 parts In-Stock

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12,500

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Digiode

USA . 1,520 parts In-Stock

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-

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1,520

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-

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Nova Conductors

Japan . 900 parts In-Stock

1+ parts

-

100+ parts

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900

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Anansix

USA . 289 parts In-Stock

1+ parts

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289

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Prism Electronics

USA . 244 parts In-Stock

1+ parts

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244

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Vyrian

USA . 138 parts In-Stock

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138

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Pegasus Components GmbH

Germany . 27 parts In-Stock

1+ parts

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27

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LittleDiode

UK . 7 parts In-Stock

1+ parts

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7

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 422 parts In-Stock

1+ parts

$6.014

100+ parts

-

1k+ parts

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10k+ parts

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422

$6.014

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-

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Ampacity Inc.

Singapore . 1,595 parts In-Stock

1+ parts

$525.000

100+ parts

-

1k+ parts

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10k+ parts

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1,595

$525.000

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One Stop Electronics

USA . 136 parts In-Stock

1+ parts

$629.000

100+ parts

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136

$629.000

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Metaverse IC Inc.

Canada . 99,168 parts In-Stock

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99,168

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Kepictronics

USA . 80,723 parts In-Stock

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80,723

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UNI Independent Distributors

Spain . 6,662 parts In-Stock

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6,662

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Corphita

USA . 3,945 parts In-Stock

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3,945

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Infinite Electronics LLP (Excess)

. 3,261 parts In-Stock

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3,261

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Authorized Procurement Solutions

USA . 3,200 parts In-Stock

1+ parts

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3,200

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-

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A-Z Elektronik GmbH

Germany . 3,000 parts In-Stock

1+ parts

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3,000

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-

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Continental Prestige Electronics

USA . 2,577 parts In-Stock

1+ parts

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2,577

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Aranea Global

USA . 2,000 parts In-Stock

1+ parts

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100+ parts

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2,000

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-

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Alle Elektronik GmbH

Germany . 2,000 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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2,000

-

-

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Argo Parts USA

USA . 1,427 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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1,427

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Assy Fe

Spain . 100 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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100

-

-

-

-

Overview

Experience seamless connectivity like never before with the AU5790D by NXP Semiconductors. This high-quality network interface offers unparalleled reliability and performance, making it the perfect choice for a wide range of applications. Whether you're in automotive, telecommunications, or any other industry, this innovative product delivers exceptional value, benefits, and advantages to meet your specific needs. Trust NXP Semiconductors to provide cutting-edge technology that takes your connectivity to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and reliability of the product, making it suitable for various environmental conditions.

Surface Mount: YES

Being surface mountable simplifies the installation process and saves space on the PCB, making it more efficient.

Power Supplies (V): 12

Operating at 12V allows compatibility with standard power supplies, offering flexibility in design and integration.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this product can withstand heat and operate reliably in challenging conditions.

Data Rate: 0.1 Mbps

Despite the low data rate, this product is suitable for applications where a high-speed connection is not critical but reliability is paramount.

Technical Specifications

Network Interfaces AU5790D attributes and parameters. Explore more Network Interfaces devices from NXP Semiconductors

Specs

Data Rate:

.1 Mbps

JESD-30 Code:

R-PDSO-G8

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Terminals:

8

No. of Transceivers:

1

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

12

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Network Interfaces

Maximum Supply Current:

.045 mA

Nominal Supply Voltage:

13 V

Surface Mount:

YES

Technology:

BICMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

AU5790D Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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