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ADC1613S125HN/C1,5

NXP Semiconductors

ADC1613S125HN/C1,5 by NXP Semiconductors

ADC1613S125HN/C1,5 from NXP is a 16-bit A/D converter with a max linearity error of just 0.0076%. It operates b/w -40 °C to 85 °C and supports power supplies of 1.8V and 3V. Ideal for industrial applications, it features a compact chip carrier design.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,366 parts In-Stock

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4,366

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Digiode

USA . 3,957 parts In-Stock

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3,957

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Anansix

USA . 2,757 parts In-Stock

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2,757

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Distributors (Availability)

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AZTECH Wire

Italy . 1,038 parts In-Stock

1+ parts

$17.430

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1,038

$17.430

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One Stop Electronics

USA . 180 parts In-Stock

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$27.000

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180

$27.000

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UNI Independent Distributors

Spain . 5,199 parts In-Stock

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5,199

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Microchip USA

USA . 4,469 parts In-Stock

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4,469

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Corphita

USA . 2,695 parts In-Stock

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2,695

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Northwest PG Solutions

USA . 1,350 parts In-Stock

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1,350

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Native Components

USA . 928 parts In-Stock

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928

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Overview

Unlock unparalleled precision and reliability with the ADC1613S125HN/C1,5 from NXP Semiconductors. Renowned for their commitment to quality, NXP delivers an analog-to-digital converter that empowers your applications with exceptional accuracy, even in demanding environments. From industrial automation to medical devices, this versatile solution ensures seamless performance while minimizing power consumption. Elevate your projects with NXP’s trusted technology, where innovation meets excellence!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material provides durability and protection against environmental factors, making this product reliable for long-term use.

Surface Mount: YES

Being a surface mount device enables easier integration into compact electronic circuits, suitable for space-constrained applications.

Package Shape: SQUARE

The square package shape allows for efficient space utilization on the PCB, making it ideal for high-density designs.

No. of Bits: 16

With 16 bits of resolution, this converter offers high accuracy and detail in signal conversion, making it suitable for applications requiring precision.

Maximum Linearity Error (EL): 0.0076%

A low maximum linearity error ensures high fidelity and accuracy in signal representation, which is critical in precision applications.

Power Supplies (V): 1.8, 3

Supporting dual supply voltages enhances flexibility in system design and enables compatibility with a range of devices.

No. of Terminals: 32

A higher number of terminals facilitates versatile connections and enhanced functionality, making it adaptable for various application needs.

Package Style (Meter): CHIP CARRIER

A chip carrier package style promotes effective heat dissipation and reliable performance in industrial applications.

Maximum Operating Temperature: 85 °C

The ability to operate at high temperatures is critical for industrial environments, ensuring reliability even under demanding conditions.

Minimum Operating Temperature: -40 °C

With a low temperature rating, this product is suitable for applications in challenging environments, ensuring functionality in extreme conditions.

Terminal Position: QUAD

A quad terminal position supports efficient layout and routing on PCBs, simplifying design and manufacturing processes.

Temperature Grade: INDUSTRIAL

This industrial temperature grade assures consistent performance and reliability in industrial applications, enhancing its suitability for rugged conditions.

Maximum Analog Input Voltage: 2 V

This spec allows for the safe handling of signals up to 2 V, making it ideal for various low-voltage applications.

Terminal Form: NO LEAD

No lead terminal form supports a compact design and can improve solderability, making it easier to manage during assembly.

Converter Type: A/D CONVERTER

As an Analog-to-Digital converter, it is essential for converting real-world analog signals into digital data, crucial for modern electronics.

Output Bit Code: OFFSET BINARY, 2'S COMPLEMENT BINARY, GRAY CODE

The support for multiple output bit codes provides flexibility in digital processing and applications, accommodating varying system requirements.

Terminal Pitch: 0.635 mm

A terminal pitch of 0.635 mm allows for high-density packing in PCB designs, making it well-suited for compact electronic devices.

Technical Specifications

Analog-to-Digital Converters ADC1613S125HN/C1,5 attributes and parameters. Explore more Analog-to-Digital Converters devices from NXP Semiconductors

Converter Specifications

Converter Type:

No. of Analog In Channels:

1

No. of Functions:

1

No. of Bits:

16

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Offset Binary, 2's Complement Binary, Gray Code

Maximum Linearity Error (EL):

0.0076 %

Electrical Specifications

Power Supplies:

1.8,3 V

Maximum Analog Input Voltage:

2 V

Operating Conditions

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Form Factor

Terminal Position:

Quad

No. of Terminals:

32

Terminal Form:

Terminal Pitch:

0.025 in (0.635 mm)

Surface Mount:

Yes

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Chip Carrier

Package Shape:

Package Equivalence Code:

LCC32,.27SQ,25

Package Code:

Standards and Codes

JESD-30 Code:

S-PQCC-N32

Qualified:

No

Trade Compliance

ADC1613S125HN/C1,5 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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