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ADC1415S125HN/C1,5

NXP Semiconductors

ADC1415S125HN/C1,5 by NXP Semiconductors

ADC1415S125HN/C1,5 by NXP is a 14-bit A/D converter ideal for industrial applications. It features a max linearity error of 0.03% and operates b/w -40 °C to 85 °C with a supply voltage of 3.5V. Its compact chip carrier design ensures efficient surface mounting.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

USA . 3,354 parts In-Stock

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Digiode

USA . 195 parts In-Stock

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195

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Anansix

USA . 189 parts In-Stock

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189

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Advanced Electronics

New Zealand . 1,500 parts In-Stock

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$6.475

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$6.411

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$6.152

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$6.475

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AZTECH Wire

Italy . 891 parts In-Stock

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$8.210

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One Stop Electronics

USA . 856 parts In-Stock

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Component Stockers USA

USA . 525 parts In-Stock

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$99.990

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QUARKTWIN TECHNOLOGY LTD

USA . 8,369 parts In-Stock

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Corphita

USA . 4,766 parts In-Stock

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Microchip USA

USA . 3,120 parts In-Stock

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UNI Independent Distributors

Spain . 1,605 parts In-Stock

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Northwest PG Solutions

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Native Components

USA . 765 parts In-Stock

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Overview

Unlock unparalleled performance with the ADC1415S125HN/C1,5 from NXP Semiconductors, a leader in innovative technology. This advanced 14-bit analog-to-digital converter offers exceptional accuracy and reliability for industrial applications, ensuring precise data capture even in extreme temperatures. Experience reduced system complexity and enhanced efficiency, empowering your designs to achieve their fullest potential while benefiting from NXP's commitment to quality and support.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and reliability, making the product suitable for various applications.

Surface Mount: YES

Surface mount compatibility allows for easier integration into modern PCB designs, saving space and facilitating high-density layouts.

Package Shape: SQUARE

The square shape aids in efficient space utilization on the PCB, allowing for more compact device designs.

No. of Bits: 14

With 14 bits of resolution, the converter offers high precision, ensuring accurate conversion of analog signals.

Maximum Linearity Error (EL): 0.03%

A low maximum linearity error ensures that the output accurately represents the input signal, enhancing the measurement accuracy.

Power Supplies (V): 3,5

Flexible power supply options make it versatile for various applications that require different voltage levels.

No. of Terminals: 40

A larger number of terminals allows for more signal connections and increased functionality within the design.

Package Style (Meter): CHIP CARRIER

Chip carrier packaging improves thermal performance and allows for better electrical connections for high-performance applications.

Maximum Operating Temperature: 85 °C

The ability to operate at elevated temperatures makes this product suitable for industrial applications where heat dissipation is a concern.

Minimum Operating Temperature: -40 °C

A wide operational temperature range ensures reliability in extreme conditions, making it ideal for harsh environments.

Terminal Finish: MATTE TIN

The matte tin finish enhances solderability and corrosion resistance, improving the overall reliability of connections.

Terminal Position: QUAD

Quad terminal positioning provides a compact layout, which can enhance performance and reduce the package size.

Temperature Grade: INDUSTRIAL

Industrial temperature grading signifies reliability in demanding conditions, reinforcing confidence for critical applications.

Maximum Analog Input Voltage: 2V

A maximum input voltage of 2V expands the range of applications for low voltage signals, making it adaptable to various use cases.

Terminal Form: NO LEAD

No lead design improves environmental friendliness and can reduce PCB space requirements, aligning with modern design trends.

Converter Type: A/D CONVERTER

As an A/D converter, it effectively transforms analog signals into digital form, meeting the needs of digital systems.

Output Bit Code: OFFSET BINARY

Offset binary output coding provides specific signaling formats that are widely compatible with different systems.

Terminal Pitch: 0.5 mm

A terminal pitch of 0.5 mm allows for higher packing density on PCBs, making it suitable for compact designs.

Technical Specifications

Analog-to-Digital Converters ADC1415S125HN/C1,5 attributes and parameters. Explore more Analog-to-Digital Converters devices from NXP Semiconductors

Converter Specifications

Converter Type:

No. of Analog In Channels:

1

No. of Functions:

1

No. of Bits:

14

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Offset Binary

Maximum Linearity Error (EL):

0.03 %

Electrical Specifications

Power Supplies:

3,5 V

Maximum Analog Input Voltage:

2 V

Operating Conditions

Moisture Sensitivity Level (MSL):

1

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Form Factor

Terminal Position:

Quad

No. of Terminals:

40

Terminal Form:

Terminal Pitch:

0.02 in (0.5 mm)

Surface Mount:

Yes

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Chip Carrier

Package Shape:

Package Equivalence Code:

LCC40,.24SQ,20

Package Code:

Standards and Codes

JESD-30 Code:

S-PQCC-N40

Qualified:

No

JESD-609 Code:

e3

Trade Compliance

ADC1415S125HN/C1,5 Converters trade compliance attributes, and parameters.

ECCN

3A991.C.3

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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