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ADC1415S105HN/C1,5

NXP Semiconductors

ADC1415S105HN/C1,5 by NXP Semiconductors

ADC1415S105HN/C1,5 from NXP is a 14-bit A/D converter ideal for industrial applications. It features a max linearity error of 0.03% and operates b/w -40 °C to 85 °C with power supplies of 3/5V. Its compact chip carrier design ensures efficient surface mounting.

Median Price

$27.740

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 119 parts In-Stock

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-

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$27.740

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$24.820

10k+ parts

$23.360

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$23.360

DigiKey

USA . 119 parts In-Stock

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119

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Digiode

USA . 1,793 parts In-Stock

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$29.355

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1,793

$29.355

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Vyrian

USA . 7,559 parts In-Stock

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Anansix

USA . 242 parts In-Stock

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Distributors (Availability)

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Native Components

USA . 856 parts In-Stock

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$9.764

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856

$9.764

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Northwest PG Solutions

USA . 284 parts In-Stock

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$10.740

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$9.666

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Corphita

USA . 220 parts In-Stock

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$27.810

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Component Stockers USA

USA . 126 parts In-Stock

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$31.300

100+ parts

$29.420

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126

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$29.420

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QUARKTWIN TECHNOLOGY LTD

USA . 8,776 parts In-Stock

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Microchip USA

USA . 3,304 parts In-Stock

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UNI Independent Distributors

Spain . 3,254 parts In-Stock

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Overview

Unlock unparalleled performance with the ADC1415S105HN/C1,5 from NXP Semiconductors, a leader in innovative technology. This advanced analog-to-digital converter delivers exceptional accuracy and reliability, making it ideal for demanding industrial applications. With its robust design and impressive temperature range, you’ll experience seamless integration into your systems, ensuring high-quality data conversion and enhanced efficiency. Choose NXP for unmatched quality and value in your next project!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and resistance to environmental stress, making it suitable for various industrial applications.

Surface Mount: YES

Being surface mount allows for easier integration into compact PCB designs, optimizing space and facilitating automated assembly.

Package Shape: SQUARE

A square package shape provides a balanced thermal distribution and efficient layout on circuit boards, improving overall design performance.

No. of Bits: 14

With 14 bits resolution, this ADC delivers high accuracy and detail in signal conversion, making it ideal for precision applications.

Maximum Linearity Error (EL): 0.03 %

A low maximum linearity error of 0.03% ensures high reliability in signal representation, critical for applications requiring fine adjustments.

Power Supplies (V): 3/5

Compatible with both 3V and 5V power supplies offers flexibility in integration with various systems, enhancing its usability.

No. of Terminals: 40

Having 40 terminals allows for diverse connectivity options and supports complex interfacing needs in advanced circuitry.

Package Style (Meter): CHIP CARRIER

The chip carrier style promotes effective heat dissipation and reduces interference, crucial for maintaining signal integrity in high-performance applications.

Maximum Operating Temperature: 85 °C

A maximum operating temperature of 85 °C indicates robustness for use in demanding environments without compromising performance.

Minimum Operating Temperature: -40 °C

Operating effectively down to -40 °C makes this ADC suitable for harsh conditions found in industrial and automotive applications.

Terminal Finish: MATTE TIN

The matte tin finish offers good solderability and enhances corrosion resistance, promoting long-term reliability in electronic assemblies.

Terminal Position: QUAD

The quad terminal position allows for compact layout designs, facilitating high-density circuit board arrangements.

Temperature Grade: INDUSTRIAL

Designed for industrial use, this ADC can withstand extreme conditions, making it a trusted choice for critical systems.

Terminal Form: NO LEAD

No lead terminals contribute to a smaller environmental footprint and comply with modern regulations, appealing to eco-conscious industries.

Converter Type: A/D CONVERTER

As an analog-to-digital converter, it plays a vital role in digitizing analog signals, crucial for digital processing in various applications.

Output Bit Code: OFFSET BINARY

The offset binary output format enhances compatibility with common digital systems, simplifying integration processes.

Terminal Pitch: 0.5 mm

A terminal pitch of 0.5 mm allows for high-density placement on PCBs, making it ideal for miniaturized electronic devices.

Technical Specifications

Analog-to-Digital Converters ADC1415S105HN/C1,5 attributes and parameters. Explore more Analog-to-Digital Converters devices from NXP Semiconductors

Converter Specifications

Converter Type:

No. of Analog In Channels:

1

No. of Functions:

1

No. of Bits:

14

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Offset Binary

Maximum Linearity Error (EL):

0.03 %

Electrical Specifications

Power Supplies:

3/5 V

Operating Conditions

Moisture Sensitivity Level (MSL):

1

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Form Factor

Terminal Position:

Quad

No. of Terminals:

40

Terminal Form:

Terminal Pitch:

0.02 in (0.5 mm)

Surface Mount:

Yes

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Chip Carrier

Package Shape:

Package Equivalence Code:

LCC40,.24SQ,20

Package Code:

Standards and Codes

JESD-30 Code:

S-PQCC-N40

Qualified:

No

JESD-609 Code:

e3

Trade Compliance

ADC1415S105HN/C1,5 Converters trade compliance attributes, and parameters.

ECCN

3A991.C.3

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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