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ADC1415S080HN/C1,5

NXP Semiconductors

ADC1415S080HN/C1,5 by NXP Semiconductors

ADC1415S080HN/C1,5 by NXP is a 14-bit A/D converter designed for industrial applications. It features a max linearity error of 0.03% and operates b/w -40 °C to 85 °C with power supplies of 3/5V. Its compact chip carrier design ensures efficient surface mounting.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,820 parts In-Stock

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4,820

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Anansix

USA . 1,159 parts In-Stock

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1,159

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Digiode

USA . 742 parts In-Stock

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742

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Distributors (Availability)

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Corohmni

South Africa . 340 parts In-Stock

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$8.381

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340

$8.381

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AZTECH Wire

Italy . 912 parts In-Stock

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$18.450

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912

$18.450

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Advanced Electronics

New Zealand . 77 parts In-Stock

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$18.494

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$16.830

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$15.165

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77

$18.494

$16.830

$15.165

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One Stop Electronics

USA . 557 parts In-Stock

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$19.000

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557

$19.000

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Microchip USA

USA . 2,435 parts In-Stock

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$20.658

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2,435

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Component Stockers USA

USA . 392 parts In-Stock

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$99.990

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392

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QUARKTWIN TECHNOLOGY LTD

USA . 25,403 parts In-Stock

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25,403

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UNI Independent Distributors

Spain . 3,795 parts In-Stock

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3,795

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Corphita

USA . 2,772 parts In-Stock

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2,772

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Northwest PG Solutions

USA . 723 parts In-Stock

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723

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Native Components

USA . 62 parts In-Stock

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62

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Overview

Unlock unparalleled performance with the ADC1415S080HN/C1,5 from NXP Semiconductors—a leader in innovative solutions. This cutting-edge analog-to-digital converter seamlessly integrates into diverse applications, from industrial automation to medical devices, ensuring precision and reliability. Experience exceptional linearity and robust temperature resilience, making it the perfect choice for demanding environments. Elevate your design with NXP’s commitment to quality and innovation, delivering lasting value and performance you can trust.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy provides durability and resistance to environmental factors, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for a compact design and ease of integration into modern circuit boards.

Package Shape: SQUARE

The square shape facilitates efficient space utilization on the PCB, making it ideal for high-density designs.

No. of Bits: 14

A 14-bit resolution offers high precision and accuracy, suitable for applications requiring fine measurements.

Maximum Linearity Error (EL): 0.03%

A low maximum linearity error ensures reliable and accurate conversion, enhancing the fidelity of the output signal.

Power Supplies (V): 3/5

Flexible power supply options (3V or 5V) allow for versatility in various applications and systems.

No. of Terminals: 40

A 40-terminal configuration supports complex functions and connectivity with other components.

Package Style (Meter): CHIP CARRIER

Chip carrier packaging enhances thermal performance and reliability, making it suitable for industrial applications.

Maximum Operating Temperature: 85 °C

Withstanding high temperatures ensures reliability in demanding environments, suitable for industrial applications.

Minimum Operating Temperature: -40 °C

A wide temperature range ensures functionality in extreme conditions, making it suitable for harsh environments.

Terminal Finish: MATTE TIN

Matte tin finish enhances solderability and protects against oxidation, ensuring long-term performance.

Terminal Position: QUAD

The quad terminal position allows for efficient layout and better thermal management on the PCB.

Temperature Grade: INDUSTRIAL

Rated for industrial use, this component is designed for reliability and stability in critical applications.

Terminal Form: NO LEAD

No lead design reduces the footprint and simplifies mounting on PCBs, essential for modern compact designs.

Converter Type: A/D CONVERTER

Being an A/D converter, it effectively converts analog signals to digital, bridging the analog-digital divide.

Output Bit Code: OFFSET BINARY

Offset binary coding simplifies digital signal processing, making it easier to interface with digital systems.

Terminal Pitch: 0.5 mm

A 0.5 mm terminal pitch allows for fine-pitch PCB designs, essential for compact applications.

Technical Specifications

Analog-to-Digital Converters ADC1415S080HN/C1,5 attributes and parameters. Explore more Analog-to-Digital Converters devices from NXP Semiconductors

Converter Specifications

Converter Type:

No. of Analog In Channels:

1

No. of Functions:

1

No. of Bits:

14

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Offset Binary

Maximum Linearity Error (EL):

0.03 %

Electrical Specifications

Power Supplies:

3/5 V

Operating Conditions

Moisture Sensitivity Level (MSL):

1

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Form Factor

Terminal Position:

Quad

No. of Terminals:

40

Terminal Form:

Terminal Pitch:

0.02 in (0.5 mm)

Surface Mount:

Yes

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Chip Carrier

Package Shape:

Package Equivalence Code:

LCC40,.24SQ,20

Package Code:

Standards and Codes

JESD-30 Code:

S-PQCC-N40

Qualified:

No

JESD-609 Code:

e3

Trade Compliance

ADC1415S080HN/C1,5 Converters trade compliance attributes, and parameters.

ECCN

3A991.C.3

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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